Trenched-Bonding-Dam Device And Manufacturing Method For Same

• US 20170213864A1
• Filed: 01/22/2016
• Published: 07/27/2017
• Est. Priority Date: 01/22/2016
• Status: Active Grant

• Current Assignee: Omnivision Technologies Incorporated (Will Semiconductor Co., Ltd. Shanghai)
• Original Assignee: Omnivision Technologies Incorporated (Will Semiconductor Co., Ltd. Shanghai)
• Inventors: Tu, Chih-Hung, Chen, Teng-Sheng, Liang, Kuei-Cheng, Chang, Chia-Yang
• Granted Patent: US 10,157,943 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2223/5442 comprising non digital, non alphanumeric information, e.g. symbols
• CPC Class Codes: H01L 2223/54426 for alignment
• CPC Class Codes: H01L 2223/5446 Located in scribe lines
• CPC Class Codes: H01L 2223/5448 Located on chip prior to dicing and remaining on chip after dicing
• CPC Class Codes: H01L 2223/54486 Located on package parts, e.g. encapsulation, leads, package substrate
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing

Abstract

Trenched-bonding-dam devices and corresponding methods of manufacture are provided. A trenched-bonding-dam device includes a bonding dam structure positioned upon a top surface of a substrate. The bonding dam structure has a bottom surface attached to a top surface of the substrate, an inner dam surrounded by an outer dam, and a trench between the inner and outer dams. The device may further include an optics system including a lens and an adhesive positioned within a bonding region between a bottom surface of the optics system and a top surface of at least one of the inner and outer dams. The trench may be dimensioned to receive a portion of the excess adhesive flowing laterally out of the bonding region during bonding of the substrate to the optics system, laterally confining the excess adhesive and reducing lateral bleeding of the adhesive.

Claims

1. A method for assembling a trenched-bonding-dam device, comprising:

attaching a bonding dam structure upon a top surface of a substrate, the bonding dam structure having (i) a bottom surface attached to the top surface of the substrate, (ii) an inner dam surrounded by an outer dam, and (iii) a trench between the inner and outer dams;

aligning an optics system with respect to a substrate element on the substrate, the optics system having a lens; and

bonding the aligned substrate and optics system to one another, a bottom surface of the optics system being coupled to a top surface of at least one of the inner and outer dams.

2. The method of claim 1:

the substrate being a chip scale package not attached to a wafer; and

the optics system is a die-level optics system that is not attached to a wafer.

3. The method of claim 1:

the substrate being part of a first wafer having two laterally-separated substrate elements, the two laterally-separated substrate elements including two chip-scale packages with a substrate scribe line therebetween, wherein respective bonding dam structures are attached to a top surface of each chip-scale package;

the optics system including a wafer-level optics system having at least two laterally-separated optics systems attached to a second wafer with an optics scribe line therebetween.

4. The method of claim 1, the step of attaching the bonding dam structure upon the top surface of the substrate including forming the bonding dam structure upon the top surface of the substrate.

5. The method of claim 1:

at least one of the bonding dam structure and the substrate including a first alignment marker;

the optics system including a second alignment marker; and

the step of aligning including aligning the first alignment marker with respect to the second alignment marker.

6. The method of claim 5, the first alignment marker being the top surface of one of the inner and outer dams.

7. The method of claim 5, the step of aligning further comprising aligning an optical center of the optics system with a center of the bonding dam structure.

8. The method of claim 3, the first wafer including a first alignment marker positioned within the substrate scribe line;

the second wafer including a second alignment marker positioned within the optics scribe line;

the step of aligning including aligning the first alignment marker with respect to the second alignment marker.

9. The method of claim 1, the bonding dam structure including one side having only the outer dam.

10. A trenched-bonding-dam device, comprising:

a bonding dam structure positioned upon a top surface of a substrate, the bonding dam structure having (i) a bottom surface attached to the top surface of the substrate, (ii) an inner dam surrounded by an outer dam, and (iii) a trench between the inner and outer dams.

11. The trenched-bonding-dam device of claim 10, the substrate including at least one of an image sensor and a lens.

12. The trenched-bonding-dam device of claim 10, the bonding dam structure being one of (a) a single piece structure having one of a U-shaped cross-section and a W-shaped cross-section, and (b) a two piece structure, where the inner dam is a first piece and the outer dam is a second piece of the two-piece structure.

13. The trenched-bonding-dam device of claim 10, further comprising:

an optics system including a lens; and

an adhesive, positioned within a bonding region between a bottom surface of the optics system and a top surface of at least one of (a) the inner dam and (b) the outer dam; and

the trench being dimensioned to receive a portion of the adhesive flowing laterally out of the bonding region during bonding of the substrate to the optics system, thereby laterally confining the adhesive.

14. The trenched-bonding-dam device of claim 13,

the substrate is a chip scale package not attached to a wafer;

and

the optics system being a die-level optics system that is not attached to a wafer.

15. The trenched-bonding-dam device of claim 10,

the substrate being part of a first wafer having two laterally-separated substrate elements, the two laterally-separated substrate elements including two chip-scale packages with a substrate scribe line therebetween, wherein respective bonding dam structures are attached to a top surface of each chip-scale package;

the optics system including a wafer-level optics system having at least two laterally-separated optics systems attached to a second wafer with an optics scribe line therebetween.

16. The trenched-bonding-dam device of claim 10:

at least one of the bonding dam structure and the substrate including a first alignment marker;

the optics system including a second alignment marker; and

the optics system being aligned with respect to the substrate such that the first alignment marker is approximately aligned with the second alignment marker.

17. The trenched-bonding-dam device of claim 16, the bonding dam structure including the first alignment marker.

18. The trenched-bonding-dam device of claim 16, the first alignment marker being the top surface of one of the inner and outer dams.

19. The trenched-bonding-dam device of claim 15:

the first wafer including a first alignment marker positioned within the substrate scribe line;

the second wafer including a second alignment marker positioned within the optics scribe line.

20. The trenched-bonding-dam device of claim 10, the bonding dam structure including one side having only the outer dam.

21. A trenched-bonding-dam device, comprising:

a first substrate coupled to a first lens;

a second substrate including a spacer and overlying the first substrate;

a third substrate coupled to a second lens and overlying the second substrate;

a cover overlying the third substrate;

a first bonding dam structure having (i) a bottom surface attached to a top surface of the first substrate, (ii) a top surface attached to a bottom surface of the second substrate;

(iii) a first inner dam surrounded by a first outer dam, and (iv) a first trench between the first inner dam and the first outer dam;

a second bonding dam structure having (i) a bottom surface attached to a top surface of the second substrate, ii) a top surface attached to a bottom surface of the third substrate;

(iii) a second inner dam surrounded by a second outer dam, and (iv) a second trench between the second inner dam and the second outer dam; and

a third bonding dam structure having (i) a bottom surface attached to a top surface of the third substrate, (ii) a top surface attached to a bottom surface of the cover;

(iii) a third inner dam surrounded by a third outer dam, and (iv) a third trench between the third inner dam and the third outer dam.