Impedance compensation structure for broadband near-field magnetic-field probe and its construction method
First Claim
1. An impedance compensation structure for a broadband near-field magnetic-field probe, comprising:
- a signal via; and
a plurality of grounding vias provided around the signal via to form a coaxial via array;
wherein the plurality of grounding vias and the signal via have an identical size, all distances between each of the plurality of the grounding vias and the signal via are equal, and the plurality of the grounding vias forms a circle centered at the signal via;
wherein each of the plurality of the grounding vias is connected with a magnetic field probe top layer shield plane and a magnetic field probe bottom layer shield plane;
each of the plurality of the grounding vias keeps in a conducting state from a direct current to a high frequency, in such a manner that impedance matching of the broadband near-field magnetic-field probe is achieved;
by regulating distances between each of the plurality of the grounding vias and the signal via and amounts of the plurality of the grounding vias to accomplish impedance changes caused by the signal via, so as to ensure impedance of the magnetic-field probe is continuous.
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Abstract
An impedance compensation structure for a broadband near-field magnetic-field probe, includes: a signal via; and a plurality of grounding vias provided around the signal via to form a coaxial via array; wherein the grounding via and the signal via have an identical size, all distances of each of the plurality of the grounding vias to the signal via are equal, and the plurality of the grounding vias forms a circle centered at the signal via; wherein each of the plurality of the grounding vias is connected with a magnetic field probe top layer shield plane and a magnetic field probe bottom layer shield plane; each of the plurality of the grounding vias keeps in a conducting state from a direct current to a high frequency, in such a manner that impedance matching of the broadband near-field magnetic-field probe is achieved.
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Citations
14 Claims
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1. An impedance compensation structure for a broadband near-field magnetic-field probe, comprising:
- a signal via; and
a plurality of grounding vias provided around the signal via to form a coaxial via array;
wherein the plurality of grounding vias and the signal via have an identical size, all distances between each of the plurality of the grounding vias and the signal via are equal, and the plurality of the grounding vias forms a circle centered at the signal via;
wherein each of the plurality of the grounding vias is connected with a magnetic field probe top layer shield plane and a magnetic field probe bottom layer shield plane;
each of the plurality of the grounding vias keeps in a conducting state from a direct current to a high frequency, in such a manner that impedance matching of the broadband near-field magnetic-field probe is achieved;
by regulating distances between each of the plurality of the grounding vias and the signal via and amounts of the plurality of the grounding vias to accomplish impedance changes caused by the signal via, so as to ensure impedance of the magnetic-field probe is continuous. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
- a signal via; and
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12. A construction method for an impedance compensation structure for a broadband near-field magnetic-field probe, comprising steps of:
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step (1);
establishing a magnetic field probe model in a CST microwave studio;performing simulation design on the CST microwave studio comprising;
simulation algorithm setting, simulation background setting, simulation boundary condition setting, simulation frequency setting and check TDR simulation setting;step (2);
according to characteristics of the magnetic field probe, setting an amount of grounding vias at 6;
wherein a radius of the grounding vias is at 0.125 mm which is a minimum permissible radius in machine drilling, a target impedance to be compensated is 50Ω
; and
a distance between a grounding via and each of a plurality of signal vias is calculated at 0.9 mm according to the formula (4);step (3);
according to calculation result in the step (2), providing 6 grounding vias around the signal via, and a distance between each of the 6 grounding vias to the signal via is 0.9 mm;step (4);
observing TDR simulation result at an end of each simulation, increasing a distance from the grounding via to the signal via if impedance on a position of the signal via is a concave;
decreasing a distance from the grounding via to the signal via if impedance on a position of the signal via is a convex;
repeatedly regulating an amount of the grounding vias around the signal via, and the distance between the grounding vias and the signal via until the simulation result of the impedance reaches the target impedance. - View Dependent Claims (13, 14)
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Specification