Method And System For Hybrid Integration Of Optical Communication Systems

• US 20170219785A1
• Filed: 04/14/2017
• Published: 08/03/2017
• Est. Priority Date: 09/04/2009
• Status: Active Grant

• Current Assignee: Cisco Technology, Inc. (Cisco Systems, Inc.)
• Original Assignee: Luxtera Incorporated (Cisco Systems, Inc.)
• Inventors: Masini, Gianlorenzo, Pinguet, Thierry, Abdalla, Sherif, Peterson, Mark
• Granted Patent: US 9,829,661 B2
• Time in Patent Office: Days
• CPC Class Codes: G02B 2006/12107 Grating
• CPC Class Codes: G02B 2006/12123 Diode
• CPC Class Codes: G02B 6/12004 Combinations of two or more optical elements
• CPC Class Codes: G02B 6/34 utilising prism or grating G02B6/293 takes precedence
• CPC Class Codes: G02B 6/428 containing printed circuit boards [PCB]
• CPC Class Codes: G02B 6/4295 coupling with semiconductor devices activated by light through the light guide, e.g. thyristors, phototransistors
• CPC Class Codes: G02F 1/212 Mach-Zehnder type
• CPC Class Codes: G02F 1/2255 controlled by a high-frequency electromagnetic component in an electric waveguide structure
• CPC Class Codes: G02F 1/2257 the optical waveguides being made of semiconducting material
• CPC Class Codes: H01L 21/84 the substrate being other than a semiconductor body, e.g. being an insulating body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2225/06541 Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 27/0688 Integrated circuits having a three-dimensional layout
• CPC Class Codes: H01L 27/1203 the substrate comprising an insulating body on a semiconductor body, e.g. SOI three-dimensional layout H01L27/0688
• CPC Class Codes: H04B 10/27 Arrangements for networking

Abstract

Methods and systems for hybrid integration of optical communication systems are disclosed and may include receiving continuous wave (CW) optical signals in a silicon photonics die (SPD) from an optical source external to the SPD. The received CW optical signals may be processed based on electrical signals received from an electronics die bonded to the SPD via metal interconnects. Modulated optical signals may be received in the SPD from optical fibers coupled to the SPD. Electrical signals may be generated in the SPD based on the received modulated optical signals and communicated to the electronics die via the metal interconnects. The CW optical signals may be received from an optical source assembly coupled to the SPD and/or from one or more optical fibers coupled to the SPD. The received CW optical signals may be processed utilizing one or more optical modulators, which may comprise Mach-Zehnder interferometer modulators.

Claims

1. A method for communication, the method comprising:

in an optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal interconnects;

receiving one or more continuous wave (CW) non-modulated optical signals in said silicon photonics die from an optical source external to said silicon photonics die;

modulating said one or more received CW non-modulated optical signals in said silicon photonics die using electrical signals received from said one or more electronics die via said metal interconnects;

receiving modulated optical signals in said silicon photonics die;

generating electrical signals in said silicon photonics die based on said received modulated optical signals; and

communicating said generated electrical signals to at least one of said one or more electronics die via said metal interconnects.

2. The method according to claim 1, wherein said metal interconnects comprise copper pillars.

3. The method according to claim 1, comprising receiving said one or more CW non-modulated optical signals from an optical source assembly coupled to said silicon photonics die.

4. The method according to claim 1, comprising receiving said one or more CW non-modulated optical signals from one or more optical fibers coupled to said silicon photonics die.

5. The method according to claim 1, comprising modulating said one or more received CW non-modulated optical signals utilizing one or more optical modulators integrated in said silicon photonics die.

6. The method according to claim 5, wherein said one or more optical modulators comprise Mach-Zehnder interferometer modulators.

7. The method according to claim 1, comprising generating said electrical signals in said silicon photonics die utilizing one or more photodetectors integrated in said silicon photonics die.

8. The method according to claim 1, comprising communicating optical signals into and/or out of said silicon photonics die utilizing grating couplers.

9. The method according to claim 1, wherein said optical source comprises one or more semiconductor lasers.

10. The method according to claim 1, wherein said optical communication system comprises a plurality of transceivers.

11. A system for communication, the system comprising:

an optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal interconnects, said optical communication system being operable to;

receive one or more continuous wave (CW) non-modulated optical signals in said silicon photonics die from an optical source external to said silicon photonics die;

modulate said one or more received CW non-modulated optical signals in said silicon photonics die using electrical signals received from said one or more electronics die via said metal interconnects;

receive modulated optical signals in said silicon photonics die from;

generate electrical signals in said silicon photonics die based on said received modulated optical signals; and

communicate said generated electrical signals to at least one of said one or more electronics die via said metal interconnects.

12. The system according to claim 11, wherein said metal interconnects comprise copper pillars.

13. The system according to claim 11, wherein said optical communication system is operable to receive said one or more CW non-modulated optical signals from an optical source assembly coupled to said silicon photonics die.

14. The system according to claim 11, wherein said optical communication system is operable to receive said one or more CW non-modulated optical signals from one or more optical fibers coupled to said silicon photonics die.

15. The system according to claim 11, wherein said optical communication system is operable to modulate said one or more received CW non-modulated optical signals utilizing one or more optical modulators integrated in said silicon photonics die.

16. The system according to claim 15, wherein said one or more optical modulators comprise Mach-Zehnder interferometer modulators.

17. The system according to claim 11, wherein said optical communication system is operable to generate said electrical signals in said silicon photonics die utilizing one or more photodetectors integrated in said silicon photonics die.

18. The system according to claim 11, wherein said optical communication system is operable to communicate optical signals into and/or out of said silicon photonics die utilizing grating couplers.

19. The system according to claim 11, wherein said optical source comprises one or more semiconductor lasers.

20. A system for communication, the system comprising:

an optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal pillars, said optical communication system being operable to;

receive one or more continuous wave (CW) non-modulated optical signals in said silicon photonics die from an optical source external to said silicon photonics die;

modulate said one or more received CW non-modulated optical signals based on electrical signals received from said one or more electronics die via said metal pillars;

receive modulated optical signals in said silicon photonics die;

generate electrical signals utilizing photodetectors in said silicon photonics die based on said received modulated optical signals; and

communicate said generated electrical signals to said one or more electronics die via said metal pillars.