Method And System For Hybrid Integration Of Optical Communication Systems
First Claim
1. A method for communication, the method comprising:
- in an optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal interconnects;
receiving one or more continuous wave (CW) non-modulated optical signals in said silicon photonics die from an optical source external to said silicon photonics die;
modulating said one or more received CW non-modulated optical signals in said silicon photonics die using electrical signals received from said one or more electronics die via said metal interconnects;
receiving modulated optical signals in said silicon photonics die;
generating electrical signals in said silicon photonics die based on said received modulated optical signals; and
communicating said generated electrical signals to at least one of said one or more electronics die via said metal interconnects.
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Accused Products
Abstract
Methods and systems for hybrid integration of optical communication systems are disclosed and may include receiving continuous wave (CW) optical signals in a silicon photonics die (SPD) from an optical source external to the SPD. The received CW optical signals may be processed based on electrical signals received from an electronics die bonded to the SPD via metal interconnects. Modulated optical signals may be received in the SPD from optical fibers coupled to the SPD. Electrical signals may be generated in the SPD based on the received modulated optical signals and communicated to the electronics die via the metal interconnects. The CW optical signals may be received from an optical source assembly coupled to the SPD and/or from one or more optical fibers coupled to the SPD. The received CW optical signals may be processed utilizing one or more optical modulators, which may comprise Mach-Zehnder interferometer modulators.
5 Citations
20 Claims
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1. A method for communication, the method comprising:
in an optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal interconnects; receiving one or more continuous wave (CW) non-modulated optical signals in said silicon photonics die from an optical source external to said silicon photonics die; modulating said one or more received CW non-modulated optical signals in said silicon photonics die using electrical signals received from said one or more electronics die via said metal interconnects; receiving modulated optical signals in said silicon photonics die; generating electrical signals in said silicon photonics die based on said received modulated optical signals; and communicating said generated electrical signals to at least one of said one or more electronics die via said metal interconnects. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A system for communication, the system comprising:
an optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal interconnects, said optical communication system being operable to; receive one or more continuous wave (CW) non-modulated optical signals in said silicon photonics die from an optical source external to said silicon photonics die; modulate said one or more received CW non-modulated optical signals in said silicon photonics die using electrical signals received from said one or more electronics die via said metal interconnects; receive modulated optical signals in said silicon photonics die from; generate electrical signals in said silicon photonics die based on said received modulated optical signals; and communicate said generated electrical signals to at least one of said one or more electronics die via said metal interconnects. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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20. A system for communication, the system comprising:
an optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal pillars, said optical communication system being operable to; receive one or more continuous wave (CW) non-modulated optical signals in said silicon photonics die from an optical source external to said silicon photonics die; modulate said one or more received CW non-modulated optical signals based on electrical signals received from said one or more electronics die via said metal pillars; receive modulated optical signals in said silicon photonics die; generate electrical signals utilizing photodetectors in said silicon photonics die based on said received modulated optical signals; and communicate said generated electrical signals to said one or more electronics die via said metal pillars.
Specification