MAGNETICALLY ALIGNED CIRCUIT

• US 20170221660A1
• Filed: 01/29/2016
• Published: 08/03/2017
• Est. Priority Date: 01/29/2016
• Status: Active Grant

• Current Assignee: Microsoft Technology Licensing LLC (Microsoft Corporation)
• Original Assignee: Microsoft Technology Licensing LLC (Microsoft Corporation)
• Inventors: Holbery, James David, Fassler, Andrew L.
• Granted Patent: US 9,911,559 B2
• Time in Patent Office: Days
• CPC Class Codes: A61B 5/0531 Measuring skin impedance
• CPC Class Codes: A61B 5/0533 Measuring galvanic skin response
• CPC Class Codes: A61B 5/318 Heart-related electrical modalities, e.g. electrocardiography [ECG]
• CPC Class Codes: A61B 5/369 Electroencephalography [EEG] devices for psychotechnics A61B5/16
• CPC Class Codes: A61B 5/681 Wristwatch-type devices
• CPC Class Codes: A61N 1/00 Electrotherapy; Circuits therefor A61N2/00 takes precedence; irradiation apparatus A61N5/00
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
• CPC Class Codes: H01H 1/029 comprising conducting material dispersed in an elastic support or binding material
• CPC Class Codes: H01H 11/04 of switch contacts
• CPC Class Codes: H01H 11/048 by powder-metallurgical processes
• CPC Class Codes: H01H 2300/036 Application nanoparticles, e.g. nanotubes, integrated in switch components, e.g. contacts, the switch itself being clearly of a different scale, e.g. greater than nanoscale
• CPC Class Codes: H01H 35/245 actuated by the deformation of a body of elastic material
• CPC Class Codes: H01H 36/00 Switches actuated by change of magnetic field or of electric field, e.g. by change of relative position of magnet and switch, by shielding
• CPC Class Codes: H05K 2201/0379 Stacked conductors
• CPC Class Codes: H05K 2201/10053 Switch
• CPC Class Codes: H05K 2203/104 Using magnetic force, e.g. to align particles or for a temporary connection during processing

Abstract

Examples are disclosed that relate to magnetically aligned switching circuits. One disclosed example provides an electronic component comprising a first terminal, a second terminal, and a deformable host material arranged between the first terminal and the second terminal. Aligned magnetically within the host material is an ensemble of particles each comprising a ferromagnetic material, each particle having greater electrical conductivity than the host material. The ensemble of particles is configured to form at least one complete conduction path from the first terminal to the second terminal.

Claims

1. An electronic component, comprising:

a first terminal;

a second terminal;

a deformable host material arranged between the first terminal and the second terminal; and

aligned magnetically within the host material, an ensemble of particles each having greater electrical conductivity than the host material, the ensemble of particles forming a complete conduction path from the first terminal to the second terminal.

2. The electronic component of claim 1 wherein the first terminal is resiliently deformable.

3. The electronic component of claim 1 wherein the first terminal comprises eutectic gallium indium.

4. The electronic component of claim 1 wherein the first terminal is fully encapsulated by the host material.

5. The electronic component of claim 1 wherein the second terminal is filamentous.

6. The electronic component of claim 1 wherein the second terminal forms an electrical contact to living human skin.

7. The electronic component of claim 1 wherein an average particle size is 10 to 50 microns in diameter.

8. The electronic component of claim 1 wherein the host material is an electrical insulator.

9. The electronic component of claim 1 wherein the host material includes a thermosetting polymer.

10. The electronic component of claim 1 wherein the host material includes silicone.

11. The electronic component of claim 1 wherein each particle includes a ferromagnetic material and a conductive outer surface.

12. The electronic component of claim 1 wherein the ensemble of particles includes one or more of silver-coated nickel and silver-coated ferromagnetic oxide particles.

13. The electronic component of claim 1 wherein the ensemble forms the conduction path upon depression of the host material and breaks the conduction path upon release of depression of the host material.

14. A pressure-sensitive electrical switch comprising:

a first terminal;

a second terminal;

a deformable host material arranged between the first terminal and the second terminal; and

aligned within the host material, an ensemble of particles each having greater electrical conductivity than the host material, the ensemble configured to form a complete conduction path from the first terminal to the second terminal upon depression of the host material and break the conduction path upon release of depression of the host material.

15. The electrical switch of claim 14 wherein the ensemble of particles is magnetically aligned.

16. The electrical switch of claim 14 wherein the ensemble of particles are aligned during solidification of the host material, along magnetic field lines arranged between shielded dead zones in which no particles are aligned.

17. The electrical switch of claim 14 wherein the particles are configured to move into and out of contact with depression and release of depression of the host material.

18. A method to fabricate an electronic component for a wearable device, the method comprising:

depositing a filamentous second terminal configured to form an electrical contact against living human skin;

depositing a deformable host material over the second terminal;

magnetically aligning an ensemble of particles within the host material, each particle having greater electrical conductivity than the host material; and

depositing the first terminal onto the host material, opposite the second terminal, such that the ensemble of particles forms a complete conduction path from the first terminal to the second terminal.

19. The method of claim 18 wherein the second terminal becomes immobilized in the host material upon solidification of the host material.

20. The method of claim 18 wherein the second terminal includes conductive nanowires.