SINTERING TOOL FOR THE LOWER DIE OF A SINTERING DEVICE

• US 20170221852A1
• Filed: 09/09/2015
• Published: 08/03/2017
• Est. Priority Date: 09/29/2014
• Status: Active Grant

• Current Assignee: Danfoss Silicon Power GmbH (Semikron-Danfoss)
• Original Assignee: Danfoss Silicon Power GmbH (Semikron-Danfoss)
• Inventors: Osterwald, Frank, Eisele, Ronald, Becker, Martin, Rudzki, Jacek, Paulsen, Lars, Ulrich, Holger
• Granted Patent: US 10,818,633 B2
• Time in Patent Office: Days
• CPC Class Codes: B22F 3/003 Apparatus, e.g. furnaces in general F27B
• CPC Class Codes: B22F 3/14 simultaneously
• CPC Class Codes: B23K 37/0408 for planar work
• CPC Class Codes: B23K 37/0426 Fixtures for other work
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/7598 specially adapted for batch processes
• CPC Class Codes: H01L 2224/75985 Material
• CPC Class Codes: H01L 2224/75988 Material of the auxiliary member
• CPC Class Codes: H01L 2224/83203 Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/8384 Sintering
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

Tool (10) for the lower die of a sintering device, the tool (10) having a rest (20) for an electronic subassembly (30) comprising a circuit carrier, to be sintered, where the rest (20) is formed from a material with a coefficient of linear expansion that is close to the coefficient of expansion of the circuit carrier of the electronic subassembly (30).

Claims

1. A tool for the lower die of a sintering device, the tool having a rest for an electronic subassembly comprising a circuit carrier, to be sintered, where the rest is formed from a material with a coefficient of linear expansion that is close to the coefficient of expansion of the circuit carrier of the electronic subassembly.

2. The tool according to claim 1, wherein the rest is formed from a material with a coefficient of linear expansion measured at 20°

C. of less than or equal to 15·

10<sup>−

6</sup>K<sup>−

1</sup>.

3. The tool according to claim 1, wherein the rest is formed from a material with a coefficient of linear expansion measured at 20°

C. of less than or equal to 11·

10<sup>−

6</sup>K<sup>−

1</sup>.

4. The tool according to claim 1, wherein the rest is formed by coating at least a partial region of the tool.

5. The tool according to claim 1, wherein the rest is formed as a plate and the tool has a depression receiving the rest formed as a plate.

6. The tool according to claim 5, wherein the surface of the plate serving as a rest is coated with the material.

7. The tool according to claim 5, wherein the plate is formed solidly from the material.

8. The tool according to claim 5, wherein the depression has a channel in the wall or on the bottom of the depression leading to outside the tool.

9. The tool according to claim 1, wherein the material is molybdenum or an alloy comprising molybdenum.

10. The tool according to claim 1, wherein the tool comprises a plurality of rests.

11. A sintering device with a lower die formed as a tool according to claim 1.

12. The tool according to claim 2, wherein the rest is formed from a material with a coefficient of linear expansion measured at 20°

C. of less than or equal to 11·

10<sup>−

6</sup>K<sup>−

1</sup>.

13. The tool according to claim 2, wherein the material is molybdenum or an alloy comprising molybdenum.

14. The tool according to claim 3, wherein the material is molybdenum or an alloy comprising molybdenum.

15. The tool according to claim 4, wherein the material is molybdenum or an alloy comprising molybdenum.

16. The tool according to claim 5, wherein the material is molybdenum or an alloy comprising molybdenum.

17. The tool according to claim 6, wherein the material is molybdenum or an alloy comprising molybdenum.

18. The tool according to claim 7, wherein the material is molybdenum or an alloy comprising molybdenum.

19. The tool according to claim 8, wherein the material is molybdenum or an alloy comprising molybdenum.

20. The tool according to claim 2, wherein the tool comprises a plurality of rests.