LED LIGHT SOURCE STRUCTURE AND PACKAGING METHOD

• US 20170222096A1
• Filed: 08/13/2015
• Published: 08/03/2017
• Est. Priority Date: 08/10/2015
• Status: Abandoned Application

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: FAN, Yong
• Application Number:
  US14/775,521
• Publication Number:
  US 20170222096A1
• Time in Patent Office: Days
• CPC Class Codes: C09K 11/02 Use of particular materials as binders, particle coatings or suspension media therefor
• CPC Class Codes: C09K 11/87 containing platina group metals
• CPC Class Codes: C09K 11/883 with zinc or cadmium
• CPC Class Codes: C09K 11/885 with alkaline earth metals
• CPC Class Codes: C09K 11/892 Chalcogenides
• CPC Class Codes: C09K 2211/1416 Condensed systems
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

An LED light source structure includes: a fixing bracket, an LED chip, a packaging gel and a quantum-dot glass box. The fixing bracket has a packaging slot and an installation slot from a bottom portion to a top portion of the fixing bracket, and a width of the installation slot is greater than a width of the packaging slot. The LED chip is packaged into the packaging slot by the packaging gel; the installation slot has a size matching with the quantum-dot glass box; the quantum-dot glass box is clamped and placed in the installation slot. The quantum-dot glass box includes a glass box and a quantum-dot fluorescent powder material, the glass box has a receiving cavity, and the quantum-dot fluorescent powder material is cured and packaged in the receiving cavity. A packaging method for the LED light source structure described above is also disclosed.

Claims

1. A Light Emitting Diode (LED) light source structure, comprising:

a fixing bracket having a packaging slot and an installation slot from a bottom portion to a top portion of the fixing bracket, wherein a width of the installation slot is greater than a width of the packaging slot;

an LED chip;

a packaging gel; and

a quantum-dot glass box;

wherein, the LED chip is packaged into the packaging slot by the packaging gel;

the installation slot has a size matching with the quantum-dot glass box;

the quantum-dot glass box is clamped and placed in the installation slot; and

wherein, quantum-dot glass box includes a glass box and a quantum-dot fluorescent powder material, the glass box has a receiving cavity, and the quantum-dot fluorescent powder material is cured and packaged in the receiving cavity.

2. The LED light source structure according to claim 1, wherein, a wall thickness of the glass box is ranged from 0.1 mm to 0.7 mm.

3. The LED light source structure according to claim 1, wherein, the quantum-dot fluorescent powder material includes a gel material and quantum-dot fluorescent powders mixed in the gel material.

4. The LED light source structure according to claim 3, wherein, in the quantum-dot fluorescent powder material, a weight percentage of the quantum-dot fluorescent powders is ranged from 1% to 20%.

5. The LED light source structure according to claim 4, wherein, the quantum-dot fluorescent powder is CdSe/ZnSe, CdSe/ZnS, CdS/ZnS, CdS/HgS, CdSe/ZnS/CdS, CdSe/CdS/ZnS, InP/CdS, CuInS or Graphene Oxide quantum dot.

6. The LED light source structure according to claim 4, wherein, the gel material is an ultraviolet (UV) curable adhesive or an infrared (IR) curable adhesive.

7. The LED light source structure according to claim 1, wherein, the LED chip includes a printed circuit board and an LED lamp electrically connected with the printed circuit board.

8. The LED light source structure according to claim 7, wherein, the LED lamp is a blue LED lamp or an ultraviolet LED lamp.

9. The LED light source structure according to claim 1, wherein, an upper surface of the packaging gel is not higher than a bottom of the installation slot, and the packaging gel is a silica gel.

10. A packaging method for an LED light source structure, comprising steps of:

(a) providing a fixing bracket, wherein the fixing bracket has a packaging slot and an installation slot from a bottom portion to a top portion of the fixing bracket, and a width of the installation slot is greater than a width of the packaging slot;

(b) utilizing a packaging gel to package an LED chip into the packaging slot; and

(c) clamping and placing a quantum-dot glass box in the installation slot;

wherein, quantum-dot glass box includes a glass box and a quantum-dot fluorescent powder material, the glass box has a receiving cavity, and the quantum-dot fluorescent powder material is cured and packaged in the receiving cavity.

11. The packaging method for an LED light source structure according to claim 10, wherein, a wall thickness of the glass box is ranged from 0.1 mm to 0.7 mm.

12. The packaging method for an LED light source structure according to claim 10, wherein, the quantum-dot fluorescent powder material includes a gel material and quantum-dot fluorescent powders mixed in the gel material.

13. The packaging method for an LED light source structure according to claim 12, wherein, in the quantum-dot fluorescent powder material, a weight percentage of the quantum-dot fluorescent powders is ranged from 1% to 20%.

14. The packaging method for an LED light source structure according to claim 13, wherein, the quantum-dot fluorescent powder is CdSe/ZnSe, CdSe/ZnS, CdS/ZnS, CdS/HgS, CdSe/ZnS/CdS, CdSe/CdS/ZnS, InP/CdS, CuInS or Graphene Oxide quantum dot.

15. The packaging method for an LED light source structure according to claim 13, wherein, the gel material is an ultraviolet (UV) curable adhesive or an infrared (IR) curable adhesive.

16. The packaging method for an LED light source structure according to claim 10, wherein, the LED chip includes a printed circuit board and an LED lamp electrically connected with the printed circuit board.

17. The packaging method for an LED light source structure according to claim 16, wherein, the LED lamp is a blue LED lamp or an ultraviolet LED lamp.

18. The packaging method for an LED light source structure according to claim 10, wherein, an upper surface of the packaging gel is not higher than a bottom of the installation slot, and the packaging gel is a silica gel.