CURABLE COMPOSITION, PREPREG, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE AND PRINTED WIRING BOARD

• US 20170226302A1
• Filed: 09/08/2015
• Published: 08/10/2017
• Est. Priority Date: 09/09/2014
• Status: Abandoned Application

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Inventors: FUJIWARA, HIROAKI, NAKADA, SAKI, SAITO, HIROSUKE
• Application Number:
  US15/502,930
• Publication Number:
  US 20170226302A1
• Time in Patent Office: Days
• CPC Class Codes: B32B 15/14 next to a fibrous or filamentary layer
• CPC Class Codes: B32B 15/20 comprising aluminium or copper B32B15/016 and B32B15/017 take precedence
• CPC Class Codes: B32B 2260/023 Two or more layers
• CPC Class Codes: B32B 2260/046 Synthetic resin
• CPC Class Codes: B32B 2262/101 Glass fibres
• CPC Class Codes: B32B 2307/202 Conductive
• CPC Class Codes: B32B 2307/206 Insulating
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 5/26 another layer next to it also being fibrous or filamentary relative arrangement of fibres or filaments of different layers B32B5/12
• CPC Class Codes: C08F 212/36 Divinylbenzene
• CPC Class Codes: C08F 236/22 the radical having three or more carbon-to-carbon double bonds
• CPC Class Codes: C08F 290/048 Polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
• CPC Class Codes: C08F 290/062 Polyethers
• CPC Class Codes: C08F 292/00 Macromolecular compounds obtained by polymerising monomers on to inorganic materials
• CPC Class Codes: C08F 299/00 Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
• CPC Class Codes: C08G 65/485 Polyphenylene oxides
• CPC Class Codes: C08J 2309/00 Characterised by the use of homopolymers or copolymers of conjugated diene hydrocarbons
• CPC Class Codes: C08J 2309/06 Copolymers with styrene
• CPC Class Codes: C08J 2325/10 with conjugated dienes
• CPC Class Codes: C08J 2329/10 Homopolymers or copolymers of unsaturated ethers C08J2335/08 takes precedence
• CPC Class Codes: C08J 2371/12 : Polyphenylene oxides
• CPC Class Codes: C08J 5/244 : using glass fibres
• CPC Class Codes: C08J 5/249 : characterised by the additives used in the prepolymer mixture
• CPC Class Codes: C08K 2003/2227 : of aluminium
• CPC Class Codes: C08K 3/22 : of metals
• CPC Class Codes: C08K 3/36 : Silica
• CPC Class Codes: C08K 5/01 : Hydrocarbons C08K5/0091 takes precedence
• CPC Class Codes: C08K 5/12 : of cyclic polycarboxylic acids
• CPC Class Codes: C08K 5/175 : containing COOH-groups; Esters or salts thereof
• CPC Class Codes: C08K 5/34924 : containing cyanurate groups; Tautomers thereof
• CPC Class Codes: C08K 5/49 : Phosphorus-containing compounds C08K5/0091 takes precedence
• CPC Class Codes: C08K 5/52 : Phosphorus bound to oxygen only
• CPC Class Codes: C08L 47/00 : Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers C08L45/00 takes precedence; of conjugated diene rubbers C08L9/00 - C08L21/00
• CPC Class Codes: C08L 71/126 : modified by chemical after-treatment
• CPC Class Codes: C08L 9/06 : Copolymers with styrene
• CPC Class Codes: H05K 1/0366 : reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/0373 : containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0137 : Materials

Abstract

A curable composition including a radically polymerizable compound containing an unsaturated bond within the molecule, an inorganic filler containing a metal oxide, and a dispersant containing an acidic group and a basic group. The content of the metal oxide is between 80 parts by mass and 100 parts by mass (inclusive) relative to the amount of the inorganic filler of 100 parts by mass. Components of the curable composition other than the inorganic filler are organic components. A content of the inorganic filler is between 80 parts by mass and 400 parts by mass (inclusive) relative to the amount of the organic components of 100 parts by mass. A content of the dispersant is between 0.1 part by mass and 5 parts by mass (inclusive) relative to the amount of the inorganic filler of 100 parts by mass.

Claims

1. A curable composition, comprising:

a radically polymerizable compound containing an unsaturated bond within a molecule;

an inorganic filler containing a metal oxide; and

a dispersant containing an acidic group and a basic group;

wherein;

a content of the metal oxide is between 80 parts by mass and 100 parts by mass (inclusive) relative to an amount of the inorganic filler of 100 parts by mass,

components of the curable composition other than the inorganic filler are organic components,

a content of the inorganic filler is between 80 parts by mass and 400 parts by mass (inclusive) relative to an amount of the organic components of 100 parts by mass,

a content of the dispersant is between 0.1 part by mass and 5 parts by mass (inclusive) relative to the amount of the inorganic filler of 100 parts by mass.

2. The curable composition according to claim 1, wherein:

the acidic group is at least one kind selected from the group consisting of a phosphate group, a carboxy group, a hydroxy group, and a sulfo group, and

the basic group is at least one kind selected from the group consisting of an imidazoline group, an amino group, an ammonium salt group, a pyrrole group, an imidazole group, a benzimidazole group, a pyrazole group, a pyridine group, a pyrimidine group, a pyrazine group, a pyrrolidine group, a piperidine group, a piperazine group, an indole group, an indoline group, a purine group, a quinoline group, an isoquinoline group, a quinuclidine group, and a triazine group.

3. The curable composition according to claim 1, wherein the dispersant has an acid value between 30 mg KOH/g and 150 mg KOH/g (inclusive) in terms of solid content and an amine value between 30 mg KOH/g and 150 mg KOH/g (inclusive) in terms of solid content.

4. The curable composition according to claim 1, further comprising a crosslinking agent, the crosslinking agent containing an unsaturated bond within a molecule.

5. The curable composition according to claim 1, wherein the radically polymerizable compound is a modified polyphenylene ether, the modified polyphenylene ether having a terminal functional group containing an unsaturated bond.

6. The curable composition according to claim 5, wherein:

a weight average molecular weight of the modified polyphenylene ether is between 500 and 5000 (inclusive), and

a number of functional groups per molecule of the modified polyphenylene ether is between 1 and 5 (inclusive) on average.

7. The curable composition according to claim 1, wherein the metal oxide is spherical silica.

8. The curable composition according to claim 1, further comprising a reaction initiator.

9. A prepreg, comprising:

the curable composition according to claim 1; and

a fibrous base material impregnated with the curable composition.

10. A metal foil with resin, comprising:

a metal layer; and

an insulating layer disposed on the metal layer;

the insulating layer containing the curable composition according to claim 1 in an uncured state.

11. A metal-clad laminate, comprising:

an insulating layer containing a cured product of the curable composition according to claim 1; and

a metal layer disposed on the insulating layer.

12. A printed wiring board, comprising:

an insulating layer containing a cured product of the curable composition according to claim 1; and

wiring disposed on the insulating layer.