TEMPERATURE SENSING SYSTEM FOR ROTATABLE WAFER SUPPORT ASSEMBLY

• US 20170229331A1
• Filed: 02/08/2017
• Published: 08/10/2017
• Est. Priority Date: 02/08/2016
• Status: Abandoned Application

• Current Assignee: Watlow Electric Manufacturing Company
• Original Assignee: Watlow Electric Manufacturing Company
• Inventors: Nosrati, Mohammad, Tompkins, Timothy B.
• Application Number:
  US15/427,701
• Publication Number:
  US 20170229331A1
• Time in Patent Office: Days
• CPC Class Codes: B05C 11/1015 responsive to a conditions of ambient medium or target, e.g. humidity, temperature B05C11/1005 takes precedence; responsive to position or movement of the coating head relative to the target
• CPC Class Codes: G01K 1/024 for remote indication
• CPC Class Codes: H01L 21/67103 mainly by conduction
• CPC Class Codes: H01L 21/67248 Temperature monitoring
• CPC Class Codes: H01L 21/68792 characterised by the construction of the shaft

Abstract

A semiconductor processing apparatus includes a wafer support assembly, a temperature sensor integrated in the wafer support assembly for measuring a temperature of the wafer support assembly, and a signal transmission device that wirelessly transmits a signal relating to a temperature measurement obtained by the temperature sensor to an external control module.

Claims

1. A semiconductor processing apparatus, comprising:

a wafer support assembly;

a temperature sensor integrated in the wafer support assembly for measuring a temperature of the wafer support assembly; and

a signal transmission device that wirelessly transmits a signal relating to a temperature measurement obtained by the temperature sensor to an external control module.

2. The semiconductor processing apparatus according to claim 1, wherein the signal transmission device is integrated in the wafer support assembly.

3. The semiconductor processing apparatus according to claim 1, wherein the signal transmission device includes an interactive WiFi connectivity module.

4. The semiconductor processing unit according to claim 1, further comprising a DC power supply integrated in the wafer support assembly, and an inductive power supply charging module disposed outside the wafer support assembly.

5. The semiconductor processing unit according to claim 4, wherein the inductive power supply charging module includes a first coil, and the DC power supply includes a second coil, the first coil generating magnetic field to induce an electric current in the second coil.

6. The semiconductor processing unit according to claim 1, further comprising a sensing electronic input module integrated in the wafer support assembly.

7. The semiconductor processing unit according to claim 1, wherein the wafer support assembly includes a wafer support portion and a shaft connected to the wafer support portion, wherein the temperature sensor is disposed in the wafer support portion, and the signal transmission device is disposed in the shaft.

8. The semiconductor processing apparatus according to claim 7, further comprising a heater disposed under the wafer support portion of the wafer support assembly.

9. The semiconductor processing apparatus according to claim 7, wherein the wafer support assembly is rotatable.

10. The semiconductor processing apparatus according to claim 1, wherein the external control module is a heater control module that controls a heater based on the temperature measurement.

11. A temperature sensing system comprising:

a temperature sensor for obtaining temperature information; and

a WiFi connectivity module for wirelessly transmitting a signal relating to the temperature information obtained by the temperature sensor to an external control module, wherein the temperature sensing system is part of a rotating device.

12. The temperature sensing system according to claim 11, further comprising a power source to supply power to the WiFi connectivity module, wherein the power source includes a DC power supply and an inductive power supply charging module that charges the DC power supply through induction.

13. The temperature sensing system according to claim 12, wherein the inductive power supply charging module includes a first coil, and the DC power supply includes a second coil, wherein the first coil generates a magnetic field that induces an electric current in the second coil.

14. The temperature sensing system according to claim 11, further comprising a scanning sensing electronic input module.

15. The temperature sensing system according to claim 11, further comprising an access electronic module.

16. The temperature sensing system according to claim 11, further comprising an operating system electronic module.

17. A semiconductor processing system, comprising:

a processing chamber;

a rotatable wafer support assembly including a wafer support portion disposed inside the processing chamber and a shaft connected to the wafer support portion and extending through a wall of the processing chamber;

a heater for heating the wafer support portion;

a heater control module for controlling the heater;

a temperature sensor integrated in the wafer support portion; and

a WiFi connectivity module electrically connected to the temperature sensor and wirelessly transmitting a signal relating to a temperature measurement obtained by the temperature sensor to the heater control module.

18. The semiconductor processing system according to claim 17, wherein the heater control module includes a receiver for receiving the signal from the WiFi connectivity module.

19. The semiconductor processing system according to claim 17, further comprising a DC power supply disposed in the shaft and an inductive power supply charging module disposed proximate the DC power supply and outside the shaft.

20. The semiconductor processing system according to claim 17 further comprising a scanning sensing electronic input module, an access electronic module, and an operating system electronic module.

21. The semiconductor processing system according to claim 17 further comprising a cooling device disposed around the shaft.