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TEMPERATURE SENSING SYSTEM FOR ROTATABLE WAFER SUPPORT ASSEMBLY

  • US 20170229331A1
  • Filed: 02/08/2017
  • Published: 08/10/2017
  • Est. Priority Date: 02/08/2016
  • Status: Abandoned Application
First Claim
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1. A semiconductor processing apparatus, comprising:

  • a wafer support assembly;

    a temperature sensor integrated in the wafer support assembly for measuring a temperature of the wafer support assembly; and

    a signal transmission device that wirelessly transmits a signal relating to a temperature measurement obtained by the temperature sensor to an external control module.

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