TEST APPARATUS FOR LIGHT EMITTING DEVICES
First Claim
1. A test apparatus, comprising:
- a plate unit including at least one chip mounting unit on which a light emitting diode (LED) chip to be tested is mounted, the chip mounting unit having a first region in which the LED chip is overlaid and a second region surrounding the first region;
a first electrode pad and a second electrode pad disposed in the first region and including respective extension portions extended toward the second region;
a probe portion configured to connect to the extension portions of the first and second electrode pads;
a power control unit configured to selectively apply test power to the LED chip through the probe portion; and
a light measuring unit configured to measure light properties of light emitted by the LED chip.
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Accused Products
Abstract
A testing apparatus includes a plate unit including at least one chip mounting unit on which a light emitting diode (LED) to be tested is mounted. The chip mounting unit has a first region in which the LED is overlaid and a second region surrounding the first region. The first and second electrode pads are disposed in the first region and include respective extension portions extended toward the second region. A probe portion is configured to connect to the extension portions of the first and second electrode pads. A power control unit is configured to selectively apply test power to the LED through the probe portion. A light measuring unit is configured to measure light properties of light emitted by the LED.
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Citations
20 Claims
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1. A test apparatus, comprising:
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a plate unit including at least one chip mounting unit on which a light emitting diode (LED) chip to be tested is mounted, the chip mounting unit having a first region in which the LED chip is overlaid and a second region surrounding the first region; a first electrode pad and a second electrode pad disposed in the first region and including respective extension portions extended toward the second region; a probe portion configured to connect to the extension portions of the first and second electrode pads; a power control unit configured to selectively apply test power to the LED chip through the probe portion; and a light measuring unit configured to measure light properties of light emitted by the LED chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A test apparatus device, comprising:
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a plate unit including at least one chip mounting unit on which a light emitting diode (LED) chip to be tested is mounted, having a first region in which the LED chip is overlaid and a second region surrounding the first region; a first electrode pad and a second electrode pad disposed in the first region and including respective portions extended toward the second region; a first via electrode and a second via electrode electrically connected to the first and second electrode pads respectively, and passing through the at least one chip mounting unit in a direction perpendicular to a width of the LED chip to apply test power to the first and second electrode pads; a probe portion configured to connect to the first and second via electrodes; a power control unit configured to selectively control power applied to the probe portion; a power control unit configured to selectively apply test power to the LED through the probe portion; and a light measuring unit configured to measure light properties of light emitted by the LED chip. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A test apparatus comprising:
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a movable plate configured to receive one or more test adaptors, each test adaptor configured to receive a respective light emitting diode (LED) by reducing a pressure between the respective test adaptor and a front surface of the LED opposing a photonic emitting surface of the LED, the test adaptor including a pair of displaced electrode pads configured to contact a respective pair of device electrodes disposed on the front surface of the LED; a light measurement unit configured to measure a photonic emission from the photonic emitting surface of a respective one of the LEDs to determine an optical property of the LED, the light measurement unit positioned proximal to the photonic emitting surface of the LED; and a power unit configured to supply a current to the LED through a first probe and a second probe connected between the power unit and the respective displaced electrode pad. - View Dependent Claims (17, 18, 19, 20)
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Specification