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PATTERNED CHUCK FOR SUBSTRATE PROCESSING

  • US 20170236740A1
  • Filed: 01/19/2017
  • Published: 08/17/2017
  • Est. Priority Date: 01/19/2016
  • Status: Active Grant
First Claim
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1. A chuck for semiconductor wafer, comprising:

  • a body having an insulating top surface;

    a plurality of elongated bending means, each configured to cause bending of the wafer upon thermal expansion, such that the wafer assumes a corrugated shape, and wherein all of the elongated bending means are positioned parallel to each other;

    an electrode embedded within the body.

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