Circuit Board Assembly And Method Of Manufacturing The Same
First Claim
1. A circuit board assembly comprising:
- a circuit board having an area on which electronic components are mounted; and
a cover that surrounds and supports the circuit board, the cover covering the circuit board with a clearance interposed between the cover and a portion of the circuit board, which includes the area, whereinthe cover is provided, on its inner surface, with a suppression portion that suppresses the inner surface from approaching the area when external pressure is applied to the cover.
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Accused Products
Abstract
A circuit board assembly and a method of manufacturing the same is provided, by which, when external pressure is applied to a cover, deformation of the cover caused by the external pressure is suppressed and no adverse effect is produced to electronic components on a circuit board. A cover of a circuit board assembly includes a first cover to cover a first surface of a circuit board and a second cover to cover a second surface of the circuit board. A projection portion projects from an inner surface of the first cover. When a complete circuit board assembly is formed by insert-molding using the circuit board assembly as an insert part, the projection portion suppresses deformation of the first cover and the second cover.
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Citations
6 Claims
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1. A circuit board assembly comprising:
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a circuit board having an area on which electronic components are mounted; and a cover that surrounds and supports the circuit board, the cover covering the circuit board with a clearance interposed between the cover and a portion of the circuit board, which includes the area, wherein the cover is provided, on its inner surface, with a suppression portion that suppresses the inner surface from approaching the area when external pressure is applied to the cover. - View Dependent Claims (2, 3, 4, 5)
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6. A method of manufacturing a complete circuit board assembly which includes:
- a circuit board having an area on which electronic components are mounted; and
a cover that surrounds and supports the circuit board, the cover covering the circuit board with a clearance interposed between the cover and a portion of the circuit board, which includes the area;
an outer structure made of synthetic resin which covers outer faces of the cover,the method comprising; accommodating the cover in a mold as an insert, the cover containing the circuit board; and insert-molding the outer structure on outer faces of the cover that contains the circuit board, wherein an inner surface of the cover is provided with a suppression portion that projects toward an inner surface of the cover, the inner surfaces facing each other via the circuit board; and the suppression portion suppresses the inner surfaces of the cover from being deformed by molding pressure and approaching the circuit board when the outer structure is insert-molded.
- a circuit board having an area on which electronic components are mounted; and
Specification