SYSTEM FOR MANUFACTURING ASSEMBLY BOARD AND METHOD FOR INSTALLING UNDERSUPPORTING DEVICE OF THE SYSTEM

• US 20170239764A1
• Filed: 12/12/2016
• Published: 08/24/2017
• Est. Priority Date: 02/18/2016
• Status: Active Grant

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Inventors: MANTANI, Masayuki, SAKAUE, Takaaki
• Granted Patent: US 10,449,641 B2
• Time in Patent Office: Days
• CPC Class Codes: B23P 19/04 for assembling or disassembling parts
• CPC Class Codes: B25B 11/002 Magnetic work holders
• CPC Class Codes: B25B 11/005 Vacuum work holders
• CPC Class Codes: B41F 15/0881 for printing on polyhedral articles
• CPC Class Codes: B41F 15/18 Supports for workpieces
• CPC Class Codes: B41F 15/26 for articles with flat surfaces
• CPC Class Codes: B65G 2201/0261 Puck as article support
• CPC Class Codes: H05K 13/0069 Holders for printed circuit boards
• CPC Class Codes: H05K 2203/0165 Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
• CPC Class Codes: H05K 3/1216 by screen printing or stencil printing

Abstract

A system for manufacturing an assembly board includes an undersupporting device, a carrier configured to hold the undersupporting device, a transporter, an undersupporting-device installer attachable to and detachable from the undersupporting device, a board processor, and a magnet provided on a lower surface of the undersupporting device. The transporter transports the undersupporting device to a working position by transporting the carrier to the working position while the carrier holds the undersupporting device on the lower surface of the carrier. The transported undersupporting device is fixed to the undersupporting-device installer by a magnetic force of the magnet at the working position. The transporter transports the board to the working position. The undersupporting device supports the lower surface of the board when the board is transported to the working position. The board processor performs a predetermined processing to an upper surface of the board.

Claims

1. A system for manufacturing an assembly board, comprising:

an undersupporting device;

a first carrier configured to hold the undersupporting device;

a transporter configured to transport a board and the first carrier;

an undersupporting-device installer provided below the transporter, the undersupporting-device installer being attachable to and detachable from the undersupporting device;

a board processor configured to perform a predetermined processing to an upper surface of the board; and

a first magnet provided on a lower surface of the undersupporting device,

wherein the transporter transports the undersupporting device to a working position by transporting the first carrier to the working position while the first carrier holds the undersupporting device on the lower surface of the first carrier,

wherein the transported undersupporting device is fixed to the undersupporting-device installer by a magnetic force of the first magnet at the working position,

wherein the transporter transports the board to the working position,

wherein the undersupporting device supports the lower surface of the board when the board is transported to the working position, and

wherein the board processor performs the predetermined processing to the upper surface of the board while the undersupporting device is fixed to the undersupporting-device installer and the undersupporting device supports the lower surface of the board.

2. The system of claim 1, further comprising

a second magnet provided on the lower surface of the first carrier,

wherein the first carrier holds the undersupporting device on the lower surface of the first carrier by a magnetic force of the second magnet.

3. The system of claim 1, further comprising:

an elevator mechanism configured to raise and lower the undersupporting-device installer,

wherein the elevator mechanism is configured to;

raise the undersupporting-device installer as to fix, to the undersupporting-device installer, the undersupporting device held by the first carrier; and

install the undersupporting device on the undersupporting-device installer by lowering the undersupporting-device installer while the undersupporting device is fixed to the undersupporting-device installer.

4. The system of claim 3, further comprising

a second carrier configured to hold the undersupporting device,

wherein the elevator mechanism is configured to:

raise the undersupporting-device installer to cause the second carrier to hold the undersupporting device; and

detach the undersupporting device from the undersupporting-device installer by lowering the undersupporting-device installer while the second carrier holds the undersupporting device.

5. The system of claim 4, wherein the transporter transports the undersupporting device from the working position by transporting the second carrier while the second carrier holds the undersupporting device.

6. The system of claim 1, further comprising:

an elevator mechanism configured to raise and lower the undersupporting-device installer; and

a second carrier configured to hold the undersupporting device,

wherein the elevator mechanism is configured to;

raise the undersupporting-device installer to cause the second carrier to hold the undersupporting device; and

detach the undersupporting device from the undersupporting-device installer by lowering the undersupporting-device installer while the second carrier holds the undersupporting device.

7. The system of claim 6, wherein the transporter transports the undersupporting device from the working position by transporting the second carrier while the second carrier holds the undersupporting device.

8. The system of claim 1, wherein the undersupporting device suctions the board while supporting the lower surface of the board transported to the working position by the transporter.

9. The system of claim 1,

wherein one of the undersupporting device and the undersupporting-device installer has a projection,

wherein another of the undersupporting device and the undersupporting-device installer has a recess provided therein, and

wherein the undersupporting device is installed on the undersupporting-device installer while the projection is fitted to the recess.

10. A method for installing an undersupporting device to a system for manufacturing an assembly board, the method comprising:

providing a system for manufacturing an assembly board, the system including

an undersupporting device,

a carrier configured to hold the undersupporting device,

a transporter configured to transport a board and the carrier,

an undersupporting-device installer provided below the transporter, the undersupporting-device installer being attachable to and detachable from the undersupporting device,

a magnet provided on a lower surface of the undersupporting device, and

a board processor configured to perform a predetermined processing to an upper surface of the board while the undersupporting device is fixed to the undersupporting-device installer and the undersupporting device supports the lower surface of the board;

positioning the undersupporting device at the working position by causing the transporter to transport the carrier to the working position while the carrier holds the undersupporting device; and

fixing, to the undersupporting-device installer, the undersupporting device positioned at the working position by a magnetic force of the magnet.