×

FINGERPRINT IDENTIFICATION MODULE AND MANUFACTURING METHOD THEREOF

  • US 20170243045A1
  • Filed: 01/20/2017
  • Published: 08/24/2017
  • Est. Priority Date: 02/19/2016
  • Status: Abandoned Application
First Claim
Patent Images

1. A fingerprint identification module, comprising:

  • a substrate comprising plural electrical contacts;

    a fingerprint sensor die attached on the substrate and sensing a fingerprint image, wherein the fingerprint sensor die is connected with the plural electrical contacts of the substrate through plural wires, so that the fingerprint sensor die is electrically connected with the substrate;

    a cover plate; and

    a mold compound layer formed over the substrate, wherein the fingerprint sensor die and the cover plate over the substrate are molded together through the mold compound layer, and the cover plate is exposed.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×