DEPOSITION MASK, DEPOSITION DEVICE, DEPOSITION METHOD, AND DEPOSITION MASK MANUFACTURING METHOD

• US 20170244035A1
• Filed: 10/15/2015
• Published: 08/24/2017
• Est. Priority Date: 10/15/2014
• Status: Active Grant

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: KAWATO, Shinichi, NIBOSHI, Manabu, KOBAYASHI, Yuhki, TAKIZAWA, Kazuo
• Granted Patent: US 10,090,467 B2
• Time in Patent Office: Days
• CPC Class Codes: C23C 14/02 Pretreatment of the material to be coated C23C14/04 takes precedence
• CPC Class Codes: C23C 14/04 Coating on selected surface areas, e.g. using masks
• CPC Class Codes: C23C 14/042 using masks
• CPC Class Codes: H05B 33/10 Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• CPC Class Codes: H10K 50/00 Organic light-emitting devices integrated devices or assemblies of multiple devices H10K59/00, H10K65/00; organic semiconductor lasers H01S5/36
• CPC Class Codes: H10K 50/11 characterised by the electroluminescent [EL] layers
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/166 using selective deposition, e.g. using a mask

Abstract

A magnetic material section is provided on a mask substrate so as to be interposed between Y aperture lines of the mask substrate and between X aperture line of the mask substrate. A portion of the magnetic material section which portion is interposed between the X aperture lines has a first thickness and a second thickness which is less than the first thickness, the first thickness being that of each sub-portion thereof which is positioned between mutually adjacent ones of the Y aperture lines, the second thickness being that of each sub-portion thereof which is positioned between apertures which are mutually adjacent in a Y direction.

Claims

1. The vapor deposition mask for forming a vapor-deposited film, in a matrix, on a target substrate, the vapor deposition mask comprising:

a mask substrate; and

a magnetic material section provided on a first main surface of the mask substrate,

the mask substrate including a plurality of apertures constituting (i) first aperture lines, each constituted by ones of the plurality of apertures which ones are lined up in a first direction and (ii) second aperture lines, each constituted by ones of the plurality of apertures which ones are lined up in a second direction orthogonal to the first direction,

the magnetic material section being provided so as to be (iii) interposed between the first aperture lines and (iv) interposed between the second aperture lines,

a first portion of the magnetic material, which first portion is interposed between the second aperture lines, having a first thickness and a second thickness which is less than the first thickness,

the first thickness of the first portion being that of each sub-portion thereof which is positioned between mutually adjacent ones of the first aperture lines,

the second thickness of the first portion being that of each sub-portion thereof which is positioned between ones of the plurality of apertures which ones are mutually adjacent in the first direction.

2. The vapor deposition mask of claim 1, wherein a second portion of the magnetic material section, which second portion is interposed between the first aperture lines, has a first thickness and a second thickness which is less than the first thickness of the second portion,

the first thickness of the second portion being that of each sub-portion thereof which is positioned between mutually adjacent ones of the second aperture lines,

the second thickness of the second portion being that of each sub-portion thereof which is positioned between ones of the plurality of apertures which ones are mutually adjacent in the second direction.

3. The vapor deposition mask of claim 1, wherein:

the plurality of apertures are provided in a matrix; and

each portion, of the magnetic material section, which is positioned between ones of the plurality of apertures which ones are mutually adjacent in the first direction or the second direction has a thickness which is less than that of each portion, of the magnetic material section, which is positioned between mutually diagonally adjacent ones of the plurality of apertures.

4. The vapor deposition mask of claim 1, wherein the magnetic material section includes:

main line sections, each of which is provided so as to be (i) positioned between the first aperture lines and (ii) in the form of a stripe extending in the first direction;

branch sections which extend, in parallel with the second direction, from each side of each of the main line sections; and

island sections, each of which is provided so as to be (i) between ones of the branch sections which ones extend toward each other, (ii) separate from the main line sections and the branch sections, and (iii) in a respective area, between mutually adjacent ones of the second aperture lines, where one of the first aperture lines intersects with the second aperture lines,

the island sections each having a thickness which is less than (i) that of each portion, of each of the main line sections, which portion is between mutually adjacent ones of second aperture lines and (ii) that of each of the branch sections between mutually adjacent ones of the second aperture lines.

5. The vapor deposition mask of claim 4, wherein each of the branch sections between mutually adjacent ones of second aperture lines has a thickness that is less than that of each of the main line sections.

6. The vapor deposition mask of claim 1, wherein the magnetic material section includes:

a first magnetic material film laminated onto a portion of the mask substrate which portion excludes the plurality of apertures; and

a second magnetic material film provided on a portion of the first magnetic material film which portion is positioned between mutually diagonally adjacent ones of the plurality of apertures.

7. The vapor deposition mask of claim 1, wherein the mask substrate is made from at least one material selected from a group consisting of resin and a ceramic material.

8. The vapor deposition mask of claim 7, wherein the resin includes at least one selected from a group consisting of polyimide, polyethylene, polyethylene naphthalate, polyethylene terephthalate, and epoxy resin.

9. A vapor deposition device comprising:

the vapor deposition mask as recited in claim 1;

a magnetic force generating source provided opposite from the vapor deposition mask with respect to the target substrate, the magnetic force generating source causing the vapor deposition mask to come into contact with the target substrate by magnetically attracting the magnetic material section; and

a vapor deposition source which emits vapor deposition particles toward the vapor deposition mask.

10. A vapor deposition method for forming a vapor-deposited film, in a matrix, on a target substrate by use of the vapor deposition device as recited in claim 9, the vapor deposition method comprising the steps of:

(a) causing the target substrate and the vapor deposition mask to face each other and, thereafter, causing the vapor deposition mask to come into contact with the target substrate by using the magnetic force generating source to magnetically attract the magnetic material section; and

(b) forming the vapor-deposited film on the target substrate, while the vapor deposition mask and the target substrate have been brought into contact with each other via magnetic force, by depositing vapor deposition particles onto the target substrate while concurrently causing at least one of the group consisting of (i) the target substrate, being in contact with the vapor deposition mask, and (ii) the vapor deposition source to move in the first direction.

11. The method of claim 10, wherein the vapor-deposited film is a luminescent layer of an electroluminescent display device.

12. The method of producing a vapor deposition mask, comprising the steps of:

(a) preparing a laminated body in which a magnetic material film is laminated onto a first main surface of a mask substrate;

(b) forming a magnetic material section by etching the magnetic material film such that the magnetic material section includes

main line sections, each of which is in the form of a stripe extending in a first direction,

branch sections which extend, in parallel with a second direction orthogonal to the first direction, from each side of each of the main line sections, and

island sections, each of which is provided so as to be (i) between ones of the branch sections which ones extend toward each other and (ii) separate from the main line sections and the branch sections, each of the island sections having a thickness which is less than that of (i) each of the branch sections and (ii) each portion of each of the main line sections which portion is positioned on a line passing through (i) one of the island sections and (ii) one of the branch sections adjacent to the one of the island sections; and

(c) forming apertures such that each of the apertures is in a respective region surrounded by respective ones of the main line sections, the branch sections, and the island sections.

13. The method of claim 12, wherein the step (b) includes the sub-steps of:

(d) laminating a resist onto the magnetic material film and subsequently patterning the resist, via photolithography, such that the resist includes

a pattern of main lines, each in the form of a stripe extending in the first direction,

a pattern of branches which extend, in parallel with the second direction, from each side of each of the main line sections, the branches each having a width along the first direction which width is less than that of a width, along the second direction, of each of the main lines, and

a pattern of islands, each of which is provided (i) between ones of the branch sections which ones extend toward each other and (ii) so as to be separate from the main line sections and the branch sections; and

(e) performing wet etching of the magnetic material film while using, as a mask, the resist having been patterned.

14. The method of claim 12, wherein the step (b) includes the sub-step of:

(f) forming a recessed portion in each region, of each of the main line sections, which region is opposite a region in which one of the apertures is formed.

15. The method of producing a vapor deposition mask, comprising the steps of:

(a) preparing a laminated body which includes, in the following order, a mask substrate, a first magnetic material film on a first main surface of the mask substrate, and a second magnetic material film;

(b) etching the second magnetic material film such that the second magnetic material film has a matrix pattern in which non-continuous portions of the second magnetic material film are lined up in a first direction and in a second direction orthogonal to the first direction; and

(c) forming apertures in respective positions such that each portion of the second magnetic material film, having been patterned, falls along a line passing diagonally through one of the apertures.