METHOD OF MANUFACTURING ELECTRONIC UNIT

• US 20170245373A1
• Filed: 02/16/2017
• Published: 08/24/2017
• Est. Priority Date: 02/19/2016
• Status: Abandoned Application

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: IWAMA, Akito, AWANO, Shinichi, TACHIBANA, Seiji
• Application Number:
  US15/434,466
• Publication Number:
  US 20170245373A1
• Time in Patent Office: Days
• CPC Class Codes: B05D 1/26 performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
• CPC Class Codes: B05D 5/00 Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/06 Thermal details
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2203/0126 Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
• CPC Class Codes: H05K 3/22 Secondary treatment of printed circuits H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

There is provided a method of manufacturing an electronic unit that includes an electronic component having a rectangular plate shape and generating heat during operation, and a heat dissipation gel covering the electronic component. The method includes a side surface coating step of coating opposite two side surfaces of four side surfaces of the electronic component with the heat dissipation gel by discharging the heat dissipation gel from a flat-shaped opening of a nozzle, and a top surface coating step of coating a top surface of the electronic component by discharging the heat dissipation gel from the opening of the nozzle after completion of the side surface coating step.

Claims

1. A method of manufacturing an electronic unit that includes an electronic component having a rectangular plate shape and generating heat during operation, and a heat dissipation gel covering the electronic component, comprising:

a side surface coating step of coating opposite two side surfaces of four side surfaces of the electronic component with the heat dissipation gel by discharging the heat dissipation gel from a flat-shaped opening of a nozzle; and

a top surface coating step of coating a top surface of the electronic component by discharging the heat dissipation gel from the opening of the nozzle after completion of the side surface coating step.

2. The method according to claim 1, wherein the electronic unit further includes a substrate disposed opposite to the top surface of the electronic component, and the heat dissipation gel is coated on a boundary between the opposite side surfaces and the substrate.

3. The method according to claim 1, wherein the heat dissipation gel is coated on a boundary between the substrate and the four side surfaces of the electronic component in each of the side surface coating step and the top surface coating step.

4. The method according to claim 3, wherein an outer wall of an end part on the side of the opening of the nozzle is caused to abut against the electronic component when the heat dissipation gel is coated on the boundary in each of the side surface coating step and the top surface coating step.

5. The method according to claim 1, wherein a transverse length of the opening is larger than twice a plate thickness of the end part on the side of the opening of the nozzle.

6. The method according to claim 1, wherein a longitudinal length of the opening is smaller than a longitudinal length of the opposite side surfaces.

7. The method according to claim 1, wherein, in the side surface coating step, the heat dissipation gel is discharged from the opening at a width smaller than a longitudinal length of the opposite side surfaces.

8. The method according to claim 1, wherein, in the top surface coating step, the heat dissipation gel is discharged from the opening at a width smaller than the sum of a distance between the opposite side surfaces and a width of two separate portions of the heat dissipation gel discharged in the side surface coating step.

9. The method according to claim 1, wherein, in the top surface coating step, the heat dissipation gel is discharged such that thickness of the heat dissipation gel at a position corresponding to a center of the electronic component becomes larger than at a position corresponding to both ends of the electronic component.