METHOD OF MANUFACTURING A DISPLAY DEVICE

• US 20170250380A1
• Filed: 12/27/2016
• Published: 08/31/2017
• Est. Priority Date: 02/25/2016
• Status: Active Grant

• Current Assignee: Japan Display Incorporated
• Original Assignee: Japan Display Incorporated
• Inventors: KATO, Daisuke
• Granted Patent: US 9,786,871 B2
• Time in Patent Office: Days
• CPC Class Codes: H10K 50/805 Electrodes
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 50/846 comprising getter material or desiccants
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

A light-emitting element layer and an element layer, which includes an anode and a cathode that sandwich the light-emitting element layer, are formed, and a sealing film is formed so as to cover the entire element layer. In the step of forming the sealing film, a first inorganic film is formed on the element layer. An organic film is formed on the first inorganic film. The organic film is ashed by using a foreign substance remaining on the organic film as a mask such that the organic film is left at least immediately below the mask and removed from at least a part of other areas. After the organic film is ashed, a second inorganic film is formed at least on the first inorganic film.

Claims

1. A method for manufacturing a display device, comprising the steps of:

forming a light-emitting element layer and an element layer including an anode and a cathode that sandwich the light-emitting element layer; and

forming a sealing film so as to cover the entire element layer, wherein

the step of forming the sealing film includes the steps of;

forming a first inorganic film on the element layer;

forming an organic film on the first inorganic film;

ashing the organic film by using a foreign substance remaining on the organic film as a mask such that the organic film is left at least immediately below the mask and removed from at least a part of other areas; and

forming a second inorganic film at least on the first inorganic film after ashing the organic film.

2. The method for manufacturing the display device according to claim 1, wherein

the organic film is formed over the foreign substance in the step of forming the organic film, and is thicker at a part in contact with a circumference of the foreign substance than other parts of the organic film.

3. The method for manufacturing the display device according to claim 2, wherein

the organic film is formed by vapor deposition in the step of forming the organic film.

4. The method for manufacturing the display device according to claim 2, wherein

the element layer has an uneven shape on an upper surface,

the first inorganic film is formed in the step of forming the first inorganic film so as to have a projection in accordance with the uneven shape, and

the organic film is formed in the step of forming the organic film so as to be thinner at a part over the projection of the first inorganic film than at the circumference of the projection.

5. The method for manufacturing the display device according to claim 4, wherein

the organic film is removed from over the projection in the step of asking the organic film so as to be left around the circumference of the projection of the first inorganic film.

6. The method for manufacturing the display device according to claim 4, wherein

the anode and the cathode are a plurality of pixel electrodes and a common electrode, the pixel electrodes being disposed under the light-emitting element layer, the common electrode being disposed on the light-emitting element layer,

the element layer further includes an insulating layer disposed on respective perimeters of the pixel electrodes, and

the uneven shape is formed by surfaces of the pixel electrodes exposed from the insulating layer and the unevenness of the insulating layer.