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BONDING MATERIAL AND BONDING METHOD USING SAME

  • US 20170252874A1
  • Filed: 08/31/2015
  • Published: 09/07/2017
  • Est. Priority Date: 09/01/2014
  • Status: Active Grant
First Claim
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1. A bonding material of a copper paste comprising:

  • a copper powder having an average particle diameter of 0.1 to 1 μ

    m; and

    an alcohol solvent,wherein the content of the copper powder is in the range of from 80% by weight to 95% by weight, and the content of the alcohol solvent is in the range of from 5% by weight to 20% by weight.

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