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Integrated Circuit Package with Sensor and Method of Making

  • US 20170253476A1
  • Filed: 05/23/2017
  • Published: 09/07/2017
  • Est. Priority Date: 05/27/2015
  • Status: Active Grant
First Claim
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1. An integrated circuit (“

  • IC”

    ) package comprising;

    an IC die having a top surface and a bottom surface;

    an elongate member having opposite first and second end portions and a mid portion, said mid portion engaging said top surface of said IC die; and

    an encapsulant block having a top surface, a bottom surface and opposite first and second lateral side faces, said encapsulant block encapsulating said IC die and said elongate member with at least one of said first and second end portions of said elongate member exposed;

    said IC die comprising a sensor die having a sensing element on said top surface thereof, said elongate member being constructed and arranged to transmit gas therethrough to said sensing element;

    said first and second end portions of said elongate member being exposed at opposite lateral side surfaces of said encapsulant block;

    said elongate member being one of;

    a tubular member, with at least one hole in said mid portion thereof that is constructed from at least one of;

    carbon-nylon composite, epoxy resin and fluorine-containing rubber; and

    a porous member adapted to transmit gas therethrough and constructed from at least one of polytetrafluoroethylene (“

    PTFE”

    ) and porous ceramic; and

    a leadframe having a die pad and a plurality of leads, said IC die bottom surface being attached to said die pad, said die pad and said leads being exposed at said bottom surface of said encapsulant block wherein said IC die comprises a plurality of electrical contact pads on at least one exterior surface thereof that are wire bonded to at least one of said plurality of leadframe leads.

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