Direct Cooling Platform With Vapor Compression Refrigeration Cycle And Applications Thereof
First Claim
1. An apparatus, comprising:
- a compressor capable of compressing a refrigerant;
a condenser capable of cooling and condensing the refrigerant;
a thermal expansion valve capable of evaporating at least a portion of the refrigerant;
a cold plate capable of receiving one or more heat sources for the one or more heat sources to be disposed on the cold plate; and
a tubing connecting the compressor, the condenser, the thermal expansion valve, and the cold plate such that the refrigerant undergoes a vapor compression refrigeration cycle as the refrigerant flows through the compressor, the condenser, the thermal expansion valve and the cold plate via the tubing,wherein at least a portion of heat from the one or more heat sources is absorbed by the refrigerant via the cold plate.
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Abstract
A direct refrigeration cooling platform can cool high heat density sources such as LEDs, IC chip, power amplifiers and laser diodes. The platform utilizes a combination of technologies from a water cooled cold plate design and a vapor compression refrigeration system. The cold plate of the direct refrigeration cooling platform replaces an evaporator in a conventional vapor compression refrigeration cycle. High heat density sources are directly mounted onto the cold plate. Temperature of the cold plate is regulated based on temperature feedback and is maintained above ambient temperatures. For LED applications, a number of LEDs are mounted onto the cold plate of the direct refrigeration cooling platform. Beams of light are distributed via fiber optic light guides to remote and inaccessible locations, where light sources are to be replaced. IC chips are cooled the same way with IC chips attached to the cold plate of the direct refrigeration cooling platform.
23 Citations
20 Claims
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1. An apparatus, comprising:
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a compressor capable of compressing a refrigerant; a condenser capable of cooling and condensing the refrigerant; a thermal expansion valve capable of evaporating at least a portion of the refrigerant; a cold plate capable of receiving one or more heat sources for the one or more heat sources to be disposed on the cold plate; and a tubing connecting the compressor, the condenser, the thermal expansion valve, and the cold plate such that the refrigerant undergoes a vapor compression refrigeration cycle as the refrigerant flows through the compressor, the condenser, the thermal expansion valve and the cold plate via the tubing, wherein at least a portion of heat from the one or more heat sources is absorbed by the refrigerant via the cold plate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification