HEATER DESIGN FOR FLY HEIGHT CONTROL

• US 20170256275A1
• Filed: 02/17/2017
• Published: 09/07/2017
• Est. Priority Date: 03/01/2016
• Status: Active Grant

• Current Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Original Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Inventors: Hutchinson, Erik J., Sonda, Paul J., Martin, Richard E.
• Granted Patent: US 9,842,614 B2
• Time in Patent Office: Days
• CPC Class Codes: G11B 5/29 Structure or manufacture of unitary devices formed of plural heads for more than one track G11B5/33, G11B5/49 and subgroups take precedence; in thin film structure G11B5/31
• CPC Class Codes: G11B 5/3133 including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure G11B5/3106 takes precedence
• CPC Class Codes: G11B 5/314 where the layers are extra layers normally not provided in the transducing structure, e.g. optical layers G11B5/3196 takes precedence
• CPC Class Codes: G11B 5/607 using thermal means

Abstract

Implementations described and claimed herein includes a storage device comprising a transducer heat including at least one pair of read/write elements and a heat shaped to thermally protrude regions of the transducer head including the read/write elements. According to one implementation, the heat element includes at least one conductive portion of locally decreased resistance proximal to and between the pair of read/write elements to direct the thermally protruded close point away from a midpoint between the read/write elements.

Claims

1. Apparatus comprising:

a transducer head including a pair of read/write elements; and

a heat element for creating a thermally protruded close point on the transducer head, the heat element including at least one conductive portion of locally decreased resistance proximal to and between the pair of read/write elements to direct the thermally protruded close point away from a midpoint between the read/write elements.

2. The apparatus of claim 1, wherein the pair of read/write elements are positioned along two parallel axis bounding a central region including the conductive portion of locally decreased resistance and the heat element further includes at least one conductive portion of locally increased resistance positioned external to the central region.

3. The apparatus of claim 2, wherein the conductive portion of locally increased resistance and the conductive portion of locally decreased resistance intersect an axis substantially parallel to an air-bearing surface of the transducer head.

4. The apparatus of claim 1, wherein the pair of read/write elements includes two writers in a down-track or cross-track alignment.

5. The apparatus of claim 1, wherein the heater element includes two heaters connected in series.

6. The apparatus of claim 1, wherein the heat element includes two heaters connected in parallel.

7. The apparatus of claim 1, wherein the heater element includes two independently controllable heat elements.

8. The apparatus of claim 1, wherein the pair of read/write elements define two parallel axis bounding a central region and the heat element further includes at least two portions of locally increased resistance positioned external to the central region and on opposite sides of the read/write elements of the pair.

9. The apparatus of claim 1, wherein the heat element transfers heat to outside edge regions of the read/write elements via metallic pushblocks.

10. The apparatus of claim 9, wherein the metallic pushblocks further comprise:

two metallic pushblocks separated from one another by a gap between the read/write elements.

11. A storage device comprising:

a storage medium;

a transducer head including a pair of read/write elements; and

a heat element for protruding the read/write elements toward the storage medium, the heat element including a conductive portion of locally decreased resistance and a conductive portion of locally increased resistance in a same plane parallel to an air-bearing surface of the transducer head, the portion of locally decreased resistance positioned between the read/write elements of the pair.

12. The storage device of claim 11, wherein the pair of read/write elements define two parallel axis perpendicular to the storage medium that bound a central region including the conductive portion of locally decreased resistance, and wherein the conductive portion of locally increased resistance is positioned external to the central region and proximal to an air bearing surface of the transducer head.

13. The storage device of claim 11, wherein the the portion of locally increased resistance causes the thermally protruded close point to move away from a midpoint of the read/write elements of the pair and toward one of the read/write elements of the pair.

14. The storage device of claim 11, wherein the pair of read/write elements includes two writers in a down-track or cross-track alignment.

15. The storage device of claim 11, wherein the heater element includes two heaters connected in series.

16. The storage device of claim 11, wherein the heat element includes two heaters connected in parallel.

17. The storage device of claim 11, wherein the pair of read/write elements define two parallel axis bounding a central region and the heat element includes at least two portions of locally increased resistance positioned external to the central region and on opposite sides of the read/write elements of the pair.

18. A method comprising:

selecting a first element of a read/write element pair to perform a data access operation;

directing current through a heat element to thermally protrude the selected read/write element from an air-bearing surface of a transducer head, the heat element including at least one conductive portion of locally increased resistance and at least one conductive portion of locally decreased resistance that intersect a same axis parallel to the air-bearing surface, the portion of locally decreased resistance positioned between the first element and a second element of the read/write element pair.

19. The method of claim 18, wherein the first element and the second element define two parallel axis bounding a central region including the conductive portion of locally decreased resistance and the conductive portion of locally increased resistance is positioned external to the central region.

20. The method of claim 18, wherein the heat element transfers heat to outside edge regions of the read/write elements via two metallic pushblocks separated from one another by a gap between the read/write elements.