MICRO-TRANSFER PRINTABLE ELECTRONIC COMPONENT

• US 20170256521A1
• Filed: 12/09/2016
• Published: 09/07/2017
• Est. Priority Date: 03/03/2016
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Cok, Ronald S., Bower, Christopher, Meitl, Matthew, Prevatte, Carl
• Granted Patent: US 10,153,256 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/82005 being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/13069 : Thin film transistor [TFT]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/143 : Digital devices
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/1531 : the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/18162 : of a chip with build-up interconnect
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A micro-transfer printable electronic component includes one or more electronic components, such as integrated circuits or LEDs. Each electronic component has device electrical contacts for providing electrical power to the electronic component and a post side. A plurality of electrical conductors includes at least one electrical conductor electrically connected to each of the device electrical contacts. One or more electrically conductive connection posts protrude beyond the post side. Each connection post is electrically connected to at least one of the electrical conductors. Additional connection posts can form electrical jumpers that electrically connect electrical conductors on a destination substrate to which the printable electronic component is micro-transfer printed. The printable electronic component can be a full-color pixel in a display.

Claims

1. A micro-transfer printable electronic component, comprising:

a dielectric layer;

a plurality of electronic devices disposed in contact with the dielectric layer, each electronic device having an individual substrate and device electrical contacts for providing electrical power to the electronic device, the electronic device having a post side and an opposing stamp side;

a plurality of electrical conductors, at least one electrical conductor electrically connected to each of the device electrical contacts; and

one or more electrically conductive connection posts that protrude from the dielectric layer in a direction opposite to the stamp side, each connection post electrically connected to at least one of the electrical conductors.

2. The micro-transfer printable electronic component of claim 1, wherein the dielectric layer is on or adjacent to the post side, wherein the dielectric layer is on or adjacent to the stamp side, or comprising one or more dielectric layers that are on both the stamp side and the post side.

3. The micro-transfer printable electronic component of claim 2, wherein the dielectric layer is transparent, the electronic devices include one or more LEDs, and the LEDs emit light through the transparent dielectric layer.

4. The micro-transfer printable electronic component of claim 2, wherein the electronic devices include one or more LEDs and the LEDs emit light in a direction opposite the transparent dielectric layer.

10. The micro-transfer printable electronic component of claim 1, wherein the connection posts are first connection posts and comprising one or more electrically conductive additional connection posts that protrude beyond the post side, each additional connection post electrically connected with an electrical conductor to a first connection post or an additional connection post.

11. The micro-transfer printable electronic component of claim 1, comprising a tether or a fractured, broken, or separated tether, or wherein one or more of the electronic devices includes a fractured, broken, or separated tether.

12. The micro-transfer printable electronic component of claim 1, wherein the electronic devices include a circuit controller electrically connected to at least one connection post and to at least one device electrical contact.

13. The micro-transfer printable electronic component of claim 1, comprising:

a display substrate having a plurality of contact pads or electrical conductors; and

wherein at least one connection post is in electrical contact with at least one contact pad or at least one electrical conductor.

16. An LED display, comprising:

a display substrate;

an array of row conductors formed on or over the display substrate, the row conductors extending in a row direction;

an array of column conductors formed on or over the display substrate, the column conductors electrically isolated from the row conductors and extending in a column direction different from the row direction, the rows and column conductors formed at least partially in different electrically isolated layers; and

a plurality of micro-transfer printable electronic components according to claim 1, wherein the printable electronic components are micro-transfer printable LED components having one or more LED electronic devices and an optional circuit controller, each micro-transfer printable LED component having at least a row connection post and a column connection post; and

wherein the row connection post of each of the printable LED components is in electrical contact with a row conductor and the column connection post of each of the printable LED components is in electrical contact with a column conductor to provide a printable LED component electrically connected between each row and column conductor of the arrays of row and column conductors.

17. The LED display of claim 16, wherein the row conductors are formed in row segments between the column conductors in the same layer on the display substrate as the column conductors and comprising a jumper electrically connecting the row segments in a common row on opposite sides of a column conductor, the jumper having two or more electrically connected electrically conductive jumper connection posts, and a jumper connection post electrically connected to a row segment on each side of the column conductor to electrically connect the two row segments in the common row.

18. The LED display of claim 16, wherein:

the row conductors are formed in row segments between the column conductors in the same layer on the display substrate as the column conductors;

the connection posts are first connection posts;

the printable LED components comprise one or more electrically conductive additional connection posts that protrude beyond the post side, each additional connection post electrically connected with an electrical conductor to a first connection post or to an additional connection post; and

each printable LED component electrically connects the row segments of a common row conductor on each side of a column conductor with a first connection post and an additional connection post or with two additional connection posts to electrically connect the two row segments of the common row conductor.

19. The LED display of claim 16, wherein the printable LED components include two first connection posts and an additional connection post electrically connected to one of the two first connection posts.

20. The LED display of claim 16, wherein the row conductors include a portion that is substantially parallel to the column conductor, the portion providing a space for another printable LED component electrically connected between the row and column conductors.

21. The printable electronic component of any one of claims 1 to 20, wherein the electronic device has at least one of a width, length, and height from 2 to 5 μ

m, 5 to 10 μ

m, 10 to 20 μ

m, 20 to 50 μ

m, 50 to 100 μ

m, 100 to 250 μ

m, and 250 to 500 μ

m.

24. A micro-transfer printable electronic component wafer, comprising:

a wafer comprising a wafer material;

a patterned sacrificial layer forming sacrificial portions spaced apart by anchor portions formed on or in the wafer;

a plurality of micro-transfer printable electronic components according to claim 1, each micro-transfer printable electronic component formed entirely over a sacrificial portion and connected to an anchor by a tether.

34. The micro-transfer printable electronic component of claim 1, wherein the electronic component is an LED component having one or more LED electronic devices and an optional circuit controller and the device electrical contacts include LED electrical contacts.

35. The micro-transfer printable electronic component of claim 1, wherein the connection posts comprise an electrically conductive layer formed over a core of a different material.

36. The micro-transfer printable electronic component of claim 1, wherein the core material is one or more of a dielectric, silicon dioxide, and silicon nitride.

37. The micro-transfer printable electronic component of claim 1, wherein the connection posts extend or electrically contact an electrical conductor through a via in a dielectric layer.

38. The micro-transfer printable electronic component of claim 1, wherein the electronic component is unpackaged and the electronic devices include one or more bare dies.

5-9. -9. (canceled)

14-15. -15. (canceled)

22-23. -23. (canceled)

25-33. -33. (canceled)