THERMAL INTERFACE

• US 20170261711A1
• Filed: 03/13/2017
• Published: 09/14/2017
• Est. Priority Date: 03/11/2016
• Status: Active Grant

• Current Assignee: II-VI Delaware, Inc. (Coherent Corp.)
• Original Assignee: Finisar Corporation (II-VI Incorporated)
• Inventors: Chiang, Troy Wy Piew, Koh, Julia, Teo, Tat Ming, Wang, William H.
• Granted Patent: US 10,371,909 B2
• Time in Patent Office: Days
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4267 Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
• CPC Class Codes: G02B 6/4269 with heat sinks or radiation fins
• CPC Class Codes: G02B 6/4271 with thermo electric cooling
• CPC Class Codes: G02B 6/4273 with heat insulation means to thermally decouple or restrain the heat from spreading
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: H04B 10/40 Transceivers
• CPC Class Codes: H04B 10/50 Transmitters
• CPC Class Codes: H04B 10/501 Structural aspects
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00

Abstract

A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.

Claims

1. A thermal interface comprising:

a thermally conductive cap including;

a base defining a plurality of cap openings;

a finger extending from the base; and

an extension extending from the base; and

a gasket defining a plurality of gasket openings, the gasket located on the base of the cap such that the gasket openings are positioned over the cap openings.

2. The thermal interface of claim 1, further comprising a pad including a pliant thermal interface material.

3. The thermal interface of claim 1, further comprising an adhesive located between the gasket and the base of the cap.

4. The thermal interface of claim 1, wherein the gasket openings are smaller than the cap openings.

5. The thermal interface of claim 1, wherein the finger is a first finger and the cap includes a plurality of fingers, including the first finger.

6. The thermal interface of claim 1, wherein the extension has a length greater than a length of the finger.

7. The thermal interface of claim 1, wherein the cap is configured to be positioned at an end face of a header of an optical subassembly, and the finger and the extension are configured to be positioned at a side of the header.

8. The thermal interface of claim 1, wherein the cap includes copper.

9. An optoelectronic module comprising:

a shell including a seat;

an optical subassembly including a header having a plurality of leads;

a thermal interface comprising;

a thermally conductive cap including;

a base defining a plurality of cap openings;

a finger extending from the base; and

an extension extending from the base; and

a gasket defining a plurality of gasket openings, the gasket located on the base of the cap such that the gasket openings are positioned over the cap openings,

wherein the cap is positioned on the header of the optical subassembly such that the leads are located within the cap openings and the gasket openings, and the extension of the cap is positioned within the seat of the shell.

10. The optoelectronic module of claim 9, wherein the thermal interface further includes a pad located between the seat of the shell and the extension of the cap, the pad including a pliant thermal interface material.

11. The optoelectronic module of claim 9, wherein the thermal interface further includes an adhesive located between the gasket and the base of the cap.

12. The optoelectronic module of claim 9, wherein the gasket openings are smaller than the cap openings.

13. The optoelectronic module of claim 9, wherein the finger is a first finger and the cap includes a plurality of fingers, including the first finger.

14. The optoelectronic module of claim 9, wherein the extension has a length greater than a length of the finger.

15. The optoelectronic module of claim 9, wherein the cap includes copper.

16. The optoelectronic module of claim 9, wherein the optical subassembly includes a transmitter optical subassembly.

17. The optoelectronic module of claim 16, wherein the transmitter optical subassembly includes a thermoelectric cooler.

18. An optoelectronic module comprising:

a shell including a seat;

an optical subassembly including a header having a plurality of leads;

a thermal interface comprising;

a thermally conductive cap including;

a base defining a plurality of cap openings;

a plurality of fingers extending from the base; and

an extension extending from the base, the extension having a length greater than a length of the plurality of fingers;

a gasket defining a plurality of gasket openings smaller than the cap openings, the gasket located on the base of the cap such that the gasket openings are positioned over the cap openings, wherein the cap is positioned on the header of the optical subassembly such that the leads are located within the cap openings and the gasket openings, and the extension of the cap is positioned within the seat of the shell;

an adhesive located between the gasket and the base of the cap; and

a pad located between the seat of the shell and the extension of the cap, the pad including a pliant thermal interface material.

19. The optoelectronic module of claim 18, wherein the optical subassembly includes a transmitter optical subassembly.

20. The optoelectronic module of claim 18, wherein the cap includes copper.