Detection System for Tunable/Replaceable Edge Coupling Ring

• US 20170263478A1
• Filed: 05/31/2017
• Published: 09/14/2017
• Est. Priority Date: 01/16/2015
• Status: Abandoned Application

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: McCHESNEY, Jon, WANG, Yuhou, GENETTI, Damon Tyrone, PATERSON, Alexander
• Application Number:
  US15/609,570
• Publication Number:
  US 20170263478A1
• Time in Patent Office: Days
• CPC Class Codes: H01J 37/023 Means for mechanically adjusting components not otherwise provided for
• CPC Class Codes: H01J 37/20 Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
• CPC Class Codes: H01J 37/32082 Radio frequency generated discharge H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence
• CPC Class Codes: H01J 37/32091 the radio frequency energy being capacitively coupled to the plasma
• CPC Class Codes: H01J 37/32623 Mechanical discharge control means
• CPC Class Codes: H01J 37/32642 Focus rings
• CPC Class Codes: H01J 37/32697 Electrostatic control
• CPC Class Codes: H01J 37/32715 Workpiece holder
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/67259 Position monitoring, e.g. misposition detection or presence detection
• CPC Class Codes: H01L 21/681 using optical controlling means
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H01L 21/68735 characterised by edge profile or support profile
• CPC Class Codes: H01L 21/68742 characterised by a lifting arrangement, e.g. lift pins

Abstract

A substrate processing system includes a processing chamber. A pedestal is arranged in the processing chamber. An edge coupling ring is arranged adjacent to the pedestal and around a radially outer edge of the substrate. An actuator is configured to selectively move the edge coupling ring relative to the substrate to alter an edge coupling profile of the edge coupling ring. The substrate processing system includes a camera-based detection system that instructs the actuator to adjust a position of the edge coupling ring. The camera is configured to communicate with the controller, and the controller adjusts a position and/or focus of the camera. In response to edge coupling ring condition information from the camera, the controller operates the actuator to move the edge coupling ring vertically. In response to edge coupling ring position information from the camera, the controller operates the actuator to move the edge coupling ring horizontally.

Claims

1. A substrate processing system comprising:

a processing chamber having a first side view port;

a pedestal arranged in the processing chamber;

a liner surrounding the pedestal, the liner having at least one opening;

an edge coupling ring arranged adjacent to the pedestal, the edge coupling ring including a first portion located outside of and around a radially outer edge of a substrate when the substrate is placed on the pedestal;

an actuator configured to selectively move the first portion of the edge coupling ring relative to (i) the substrate and (ii) a second portion of the edge coupling ring located radially inward of the first portion to alter an edge coupling profile of the edge coupling ring, wherein the actuator is configured to move the first portion to at least one position where an upper surface of the first portion is above an upper surface of the substrate; and

a detector system configured to detect a condition of the edge coupling ring, the detector system comprising;

a camera configured to obtain image data of a plasma-facing surface of the edge coupling ring through the first view port; and

a first controller configured to receive the image data and determine at least one of a condition and a position of the plasma-facing surface of the edge coupling ring.

2. The substrate processing system of claim 1, wherein the detector system further comprises a lighting apparatus configured to provide light for the camera to obtain the image data of the edge coupling ring.

3. The substrate processing system of claim 2, wherein the lighting apparatus provides light through the first view port.

4. The substrate processing system of claim 2, wherein the processing chamber comprises a second view port, and wherein the lighting apparatus provides light through the second view port.

5. The substrate processing system of claim 1, further comprising:

a gas delivery system configured to deliver process gas and carrier gas to the processing chamber; and

a plasma generator configured to create plasma in the processing chamber to etch the substrate.

6. The substrate processing system of claim 5, wherein the plasma generator provides light for the camera to obtain the image data of the edge coupling ring.

7. The substrate processing system of claim 1, wherein the actuator moves the edge coupling ring vertically relative to the substrate in response to a condition indicating erosion of the plasma-facing surface of the edge coupling ring.

8. The substrate processing system of claim 1, wherein the actuator moves the edge coupling ring horizontally relative to the substrate in response to a condition indicating misalignment of the edge coupling ring.

9. The substrate processing system of claim 1, wherein the actuator moves the first portion of the edge coupling ring vertically relative to the substrate in response to a condition indicating misalignment of the edge coupling ring.

10. The substrate processing system of claim 1, further comprising a second controller configured to respond to the first controller to control the actuator to selectively move the first portion of the edge coupling ring.

11. The substrate processing system of claim 10, wherein the second controller is configured to effectuate replacement of the edge coupling ring in response to a determination of sufficient erosion of the edge coupling ring.

12. The substrate processing system of claim 1, wherein the camera is sighted onto the edge coupling ring to obtain the image data.

13. The substrate processing system of claim 1, further comprising an electrostatic chuck (ESC) arranged on the pedestal, wherein the camera is sighted onto at least one of the substrate and the ESC to obtain the image data.

14. The substrate processing system of claim 1, wherein the image data comprises image data of a section of the edge coupling ring relative to the at least one opening in the liner, and wherein the first controller calculates a height between the section of the edge coupling ring and a top of the at least one opening to determine at least one of a condition and a position of the edge coupling ring.

15. The substrate processing system of claim 14, wherein the liner has a plurality of openings;

wherein the image data comprises image data of the section of the edge coupling ring relative to the plurality of openings in the liner, and wherein the first controller calculates a plurality of heights between the section of the edge coupling ring and corresponding tops of the plurality of openings, and wherein the first controller compares the plurality of heights to determine at least one of the condition and the position of the edge coupling ring.

16. The substrate processing system of claim 1, wherein the first controller adjusts a position of the camera in response to detection of a condition of the edge coupling ring.

17. In a substrate processing system comprising a processing chamber having a first side view port, a pedestal arranged in the processing chamber, a liner surrounding the pedestal, the liner having a plurality of openings, and an edge coupling ring arranged adjacent to the pedestal, the edge coupling ring including a first portion located outside of and around a radially outer edge of a substrate on the pedestal,

a detector system for detecting one or more of a condition and a position of the edge coupling ring, the detector system comprising:

a camera obtaining image data of the edge coupling ring through the first side view port; and

a controller receiving the image data and determining at least one of the position and the condition of a plasma-facing surface of the edge coupling ring;

wherein the image data comprises image data of a section of the edge coupling ring relative to the plurality of openings in the liner, and wherein the controller calculates a plurality of heights between the section of the edge coupling ring and different tops of the plurality of openings, and wherein the controller compares the plurality of heights to determine one of the condition and the position of the edge coupling ring.

18. The detector system of claim 17, wherein the substrate processing system further comprises an electrostatic chuck (ESC) arranged on the pedestal, and wherein the camera is sighted onto one of the substrate and the ESC to obtain the image data.

19. A method for determining at least one of a condition and a position of an edge coupling ring in a substrate processing system, the method comprising:

identifying an inner edge of the edge coupling ring;

obtaining image data of the edge coupling ring relative to a fixed reference;

processing the image data to determine whether the edge coupling ring is aligned vertically;

in response to a determination that the edge coupling ring is not aligned vertically, adjusting the edge coupling ring vertically;

determining whether the inner edge of the edge coupling ring is at a predetermined height;

in response to a determination that the inner edge of the edge coupling ring is not at the predetermined height, determining whether the edge coupling ring can be adjusted vertically; and

in response to a determination that the edge coupling ring can be adjusted vertically, adjusting the edge coupling ring vertically.

20. The method of claim 19, further comprising:

in response to a determination that the edge coupling ring cannot be adjusted vertically, instructing replacement of the edge coupling ring.

21. The method of claim 19, wherein determining whether the edge coupling ring can be adjusted vertically comprises determining whether there has been a predetermined number of semiconductor processing cycles since installation of the edge coupling ring in the substrate processing system.

22. The method of claim 19, wherein determining whether the edge coupling ring can be adjusted vertically comprises determining whether a predetermined amount of time has elapsed since installation of the edge coupling ring in the semiconductor processing system.

23. The method of claim 19, wherein determining whether the edge coupling ring can be adjusted vertically comprises determining whether the edge coupling ring has been raised vertically to its maximum extent.

24. The method of claim 19, wherein adjusting the edge coupling ring vertically comprises adjusting one portion of the edge coupling ring vertically relative to another portion of the edge coupling ring.

25. The method of claim 19, further comprising:

determining whether the edge coupling ring is aligned horizontally; and

in response to a determination that the edge coupling ring is not aligned horizontally, adjusting the edge coupling ring horizontally.

26. The method of claim 25, wherein adjusting the edge coupling ring horizontally comprises moving the edge coupling ring relative to a pedestal in the substrate processing system, the substrate being arranged on the pedestal.