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TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE

  • US 20170264997A1
  • Filed: 05/26/2017
  • Published: 09/14/2017
  • Est. Priority Date: 11/28/2000
  • Status: Active Grant
First Claim
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1. A silicon condenser microphone comprising:

  • means for electrically interfacing to a printed circuit board comprising;

    a top layer comprising a first conductive layer with a first non-conductive layer disposed on a lower surface of the first conductive layer, wherein the first conductive layer is patterned to form a plurality of conductive pads;

    a bottom layer comprising a second non-conductive layer with a second conductive layer disposed on a lower surface of the second non-conductive layer, wherein the second conductive layer is pattered to form a plurality of flat solder pads, wherein the top and bottom layers are in facing relation to each other; and

    one or more electrical paths disposed completely within the means for electrically interfacing, wherein the one or more electrical paths electrically couple one or more of the plurality of conductive pads in the first conductive layer to one or more of the solder pads in the second conductive layer,wherein the means for electrically interfacing is rigid, is adapted for solder reflow surface mounting, and has substantially planar top and bottom surfaces;

    a micro-electro-mechanical system (MEMS) microphone die mounted to the top surface of the means for electrically interfacing and electrically coupled to at least one of the conductive pads in the first conductive layer; and

    a single-piece environmental protection means that includes an acoustic port,wherein the environmental protection means is formed from a solid material and has a predetermined shape with a rectangular top portion and a substantially vertical and continuous sidewall portion that adjoins the top portion at an angle and that completely surrounds and supports the top portion, the sidewall portion having a predetermined height, an exterior sidewall surface, an interior sidewall surface, and an attachment surface, the acoustic port disposed in the top portion of the environmental protection means and passing completely through the environmental protection means,wherein the attachment surface of the sidewall portion of the environmental protection means is aligned with and attached to a peripheral region along each edge of the top surface of the means for electrically interfacing, andwherein the predetermined height of the sidewall portion of the environmental protection means, the interior sidewall surface of the sidewall portion of the environmental protection means, and an interior surface of the top portion of the environmental protection means, in cooperation with the top surface of the means for electrically interfacing, provide a protective enclosure for the MEMS microphone die to reduce electromagnetic interference.

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