LED LIGHTING APPARATUS

• US 20170268753A1
• Filed: 03/15/2017
• Published: 09/21/2017
• Est. Priority Date: 03/18/2016
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: TAJIRI, Hiroyuki, HASEGAWA, Yuya
• Granted Patent: US 10,522,730 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/0268 for electrical inspection or testing
• CPC Class Codes: H05K 2201/0989 Coating free areas, e.g. areas other than pads or lands free of solder resist
• CPC Class Codes: H05K 2201/099 Coating over pads, e.g. solder resist partly over pads
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2203/049 Wire bonding
• CPC Class Codes: H05K 3/3431 Leadless components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An LED lighting apparatus is provided. The LED lighting apparatus includes LED chips, a substrate, and an electronic element. The substrate includes a mount surface on which the LED chips are mounted. The LED chips are arranged at or near a center of the mount surface of the substrate. The substrate includes a base, a wiring pattern, and an insulating layer. The wiring pattern is formed on the base. The insulating layer is formed on the base or the wiring pattern and formed with a plurality of openings. The wiring pattern includes pad portions comprising parts of the wiring pattern, respectively. Each of the parts of the wiring pattern is exposed through one of the openings of the insulating layer as viewed in a thickness direction of the substrate. Each of the LED chips is mounted on one of the pad portions.

Claims

1. An LED lighting apparatus comprising:

a plurality of LED chips;

a substrate including a mount surface on which the LED chips are mounted; and

an electronic element mounted on the substrate and including a circuit that causes the LED chips to emit light,

wherein the LED chips are arranged at or near a center of the mount surface of the substrate,

the substrate includes a base, a wiring pattern formed on the base, and an insulating layer formed on the base or the wiring pattern and formed with a plurality of openings,

the wiring pattern includes a plurality of pad portions comprising parts of the wiring pattern, respectively,

each of the parts of the wiring pattern is exposed through one of the openings of the insulating layer as viewed in a thickness direction of the substrate, and

each of the LED chips is mounted on one of the pad portions.

2. The LED lighting apparatus according to claim 1, wherein one of the pad portions includes a metal plating layer covering one of the parts of the wiring pattern, and

the metal plating layer is exposed through one of the openings of the insulating layer as viewed in the thickness direction of the substrate.

3. The LED lighting apparatus according to claim 1, further comprising a conductive paste layer positioned between one of the LED chips and one of the parts of the wiring pattern.

4. The LED lighting apparatus according to claim 3, wherein the opening of the insulating layer is circular as viewed in the thickness direction of the substrate.

5. The LED lighting apparatus according to claim 1, wherein a mounting density of the LED chips is in a range of 0.5 to 1.0 per 1 mm².

6. The LED lighting apparatus according to claim 5, further comprising a wire bonded to one of the LED chips,

wherein the pad portions include a plurality of LED-mounting pads and a plurality of wire-bonding pads,

one of the LED chips is mounted on one of the LED-mounting pads, and

the wire is bonded to one of the wire-bonding pads.

7. The LED lighting apparatus according to claim 6, wherein an area of each of the LED-mounting pads as viewed in the thickness direction of the substrate is at least twice an area of one of the LED chips as viewed in the thickness direction.

8. The LED lighting apparatus according to claim 6, wherein the wire-bonding pads are farther away from a center of the substrate than the LED-mounting pads are, as viewed in the thickness direction of the substrate.

9. The LED lighting apparatus according to claim 1, further comprising a frame formed on the substrate and surrounding the LED chips as viewed in the thickness direction of the substrate.

10. The LED lighting apparatus according to claim 9, wherein the frame includes a reflective surface inclined with respect to the thickness direction of the substrate and surrounding the LED chips as viewed in the thickness direction of the substrate.

11. The LED lighting apparatus according to claim 10, wherein the reflective surface is circular as viewed in the thickness direction of the substrate.

12. The LED lighting apparatus according to claim 11, wherein the frame has a polygonal outer configuration as viewed in the thickness direction of the substrate.

13. The LED lighting apparatus according to claim 9, wherein the frame is made of a white resin.

14. The LED lighting apparatus according to claim 9, further comprising a sealing resin portion filling a region surrounded by the frame,

wherein the sealing resin portion covers the LED chips and transmits light emitted from the LED chips.

15. The LED lighting apparatus according to claim 14, wherein the sealing resin portion includes a first sealing resin part and a second sealing resin part, and each of the LED chips includes an obverse surface facing the same direction as the mount surface of the substrate,

the first sealing resin part covers at least a part of each of the LED chips, and the part of each of the LED chips excludes the obverse surface of the each of the LED chips, and

the second sealing resin part covers the first sealing resin part and transmits light.

16. The LED lighting apparatus according to claim 15, wherein the first sealing resin part is made of a white resin.

17. The LED lighting apparatus according to claim 1, further comprising a socket supporting the substrate.

18. The LED lighting apparatus according to claim 17, wherein the socket includes a light-emitting cylindrical portion that houses the substrate and that is open in a direction in which the mount surface of the substrate faces.

19. The LED lighting apparatus according to claim 18, wherein the socket includes a bottom plate portion closing the light-emitting cylindrical portion from a side opposite to the side to which the mount surface of the substrate faces.

20. The LED lighting apparatus according to claim 19, wherein the electronic element is mounted on the mount surface of the substrate.

21. The LED lighting apparatus according to claim 20, further comprising a heat sink arranged between the bottom plate portion and the substrate.

22. The LED lighting apparatus according to claim 21, wherein the heat sink is made of aluminum.

23. The LED lighting apparatus according to claim 21, wherein the socket includes a fin projecting from the bottom plate portion away from the substrate.

24. The LED lighting apparatus according to claim 23, wherein the socket includes a coupling-side cylindrical portion that houses at least a portion of the fin.

25. The LED lighting apparatus according to claim 24, wherein the coupling-side cylindrical portion includes a stepped portion.

26. The LED lighting apparatus according to claim 25, further comprising a packing fitted to the stepped portion of the coupling-side cylindrical portion.

27. The LED lighting apparatus according to claim 1, wherein the LED chips include a plurality of first LED chips and a second LED chip,

the plurality of first LED chips are connected in series to each other and arranged to form a circle as viewed in the thickness direction of the substrate, and

the second LED chip is connected in parallel to the first LED chips and surrounded by the first LED chips as viewed in the thickness direction of the substrate.