Methods for Making an X-Ray Detector

• US 20170269237A1
• Filed: 09/08/2015
• Published: 09/21/2017
• Est. Priority Date: 09/08/2015
• Status: Active Grant

• Current Assignee: Shenzhen Xpectvision Technology Co., Ltd.
• Original Assignee: Shenzhen Expectvision Technology Company Limited
• Inventors: CAO, Peiyan, LIU, Yurun
• Granted Patent: US 10,007,007 B2
• Time in Patent Office: Days
• CPC Class Codes: G01T 1/24 with semiconductor detectors
• CPC Class Codes: H01L 27/14609 Pixel-elements with integrated switching, control, storage or amplification elements scanning details of imagers (circuitry of solid-state image sensors H04N25/00); circuitry of imagers H04N25/70
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/14658 X-ray, gamma-ray or corpuscular radiation imagers measuring X-, gamma- or corpuscular radiation G01T1/00
• CPC Class Codes: H01L 27/14661 of the hybrid type
• CPC Class Codes: H01L 27/14676 X-ray, gamma-ray or corpuscular radiation imagers measuring X-, gamma- or corpuscular radiation G01T1/00

Abstract

Disclosed herein is an apparatus suitable for detecting X-ray, the apparatus comprising: a first substrate comprising a plurality of first electric contacts; a first chip layer comprising a plurality of first chips, wherein each of the first chips comprises a first electrode and is bonded to the first substrate such that the first electrode is electrically connected to at least one of the first electrical contacts; a second substrate comprising a plurality of second electric contacts; and a second chip layer comprising a plurality of second chips, wherein each of the second chips comprises a second electrode and is bonded to the second substrate such that the second electrode is electrically connected to at least one of the second electrical contacts, wherein the first chip layer and the second chip layer are bonded to each other such that at least two second chips are bonded to a same first chip.

Claims

1. An apparatus suitable for detecting X-ray, the apparatus comprising:

a first substrate comprising a plurality of first electric contacts;

a first chip layer comprising a plurality of first chips, wherein each of the first chips comprises a first electrode and is bonded to the first substrate such that the first electrode is electrically connected to at least one of the first electrical contacts;

a second substrate comprising a plurality of second electric contacts; and

a second chip layer comprising a plurality of second chips, wherein each of the second chips comprises a second electrode and is bonded to the second substrate such that the second electrode is electrically connected to at least one of the second electrical contacts,

wherein the first chip layer and the second chip layer are bonded to each other such that at least two second chips are bonded to a same first chip.

2. The apparatus of claim 1, wherein the first chip layer and the second chip layer are bonded using a conductive material. The apparatus of claim 1, wherein the first chip layer and the second chip layer are sandwiched between the first substrate and the second substrate.

4. The apparatus of claim 1, wherein the at least two second chips and the same first chip are directly connected to a same electrode.

5. The apparatus of claim 1, wherein at least one of the first chip layer and the second chip layer is configured for absorbing X-ray.

6. The apparatus of claim 5, wherein at least one of the first substrate and the second substrate comprises an electronic system configured for processing signals generated by the absorbed X-ray.

7. The apparatus of claim 1, wherein the second substrate is thinner than the first substrate.

8. The apparatus of claim 1, wherein the first chip layer and the second chip layer comprise silicon, germanium, GaAs, CdTe, CdZnTe, or a combination thereof.

9. A method for making an apparatus suitable for detecting X-ray, the method comprising:

bonding a plurality of first chips to a first substrate to form a first chip layer, wherein the first substrate comprises a plurality of first electric contacts, wherein each of the first chips comprises a first electrode, and wherein the plurality of first chips are bonded to the first substrate such that each first electrode is electrically connected to at least one of the first electrical contacts;

bonding a plurality of second chips to a second substrate to form a second chip layer, wherein the second substrate comprises a plurality of second electric contacts, wherein each of the second chips comprises a second electrode, and wherein the plurality of second chips are bonded to the second substrate such that each second electrode is electrically connected to at least one of the second electrical contacts; and

bonding the first chip layer and the second chip layer to each other such that at least two second chips are bonded to a same first chip.

10. The method of claim 9, wherein the first chip layer and the second chip layer are bonded using a conductive material.

11. The method of claim 9, wherein the first chip layer and the second chip layer are sandwiched between the first substrate and the second substrate in the apparatus.

12. The method of claim 9, wherein the at least two second chips and the same first chip are directly connected to a same electrode.

13. The method of claim 9, wherein at least one of the first chip layer and the second chip layer is configured for absorbing X-ray.

14. The method of claim 13, wherein at least one of the first substrate and the second substrate comprises an electronic system configured for processing signals generated by the absorbed X-ray.

15. The method of claim 9, wherein the second substrate is thinner than the first substrate.

16. A method for making an apparatus suitable for detecting X-ray, the method comprising:

bonding a plurality of chips to a substrate, wherein the substrate comprises a plurality of electric contacts, wherein each of the chips comprises an X-ray absorption layer comprising an electrode, and wherein the plurality of chips are bonded to the substrate such that each electrode is electrically connected to at least one of the electrical contacts; and

electrically connecting the plurality of chips by a material on top side of the chips.

17. The method of claim 16, wherein the material is not in form of a wafer.

18. The method of claim 16, wherein the plurality of chips are electrically connected by electrical wires or conductive tapes.

19. The method of claim 16, wherein electrically connecting the plurality of chips comprises sputtering a metal layer on top of the plurality of chips.

20. The method of claim 19, wherein electrically connecting the plurality of chips further comprises filling gaps between the chips with insulating material or covering the gaps between the chips with insulating tapes.

21. A method for making an apparatus suitable for detecting X-ray, the method comprising bonding a plurality of chips to a substrate having a first surface and a second surface, wherein:

each of the chips comprises an X-ray absorption layer comprising an electrode;

the substrate comprises electronics comprising a plurality of electric contacts;

the plurality of chips are bonded to the substrate such that each electrode is electrically connected to at least one of the electrical contacts, and

the second surface is free of the electronics.

22. The method of claim 21, further comprising thinning the substrate from the second surface.

23. The method of claim 21, wherein the electronics include electrical wires each of which electrically connects at least some of the electrical contacts.

24. The method of claim 23, wherein signals from the electric contacts can be read out via the electrical wires.

25. The method of claim 23, wherein each of the electrical wires extends across multiple dies that are connected on the first surface during exposure.

26. The method of claim 25, wherein the multiple dies are connected along a first direction.

27. The method of claim 26, wherein a test pattern is placed in a gap between two dies along a second direction during exposure.

28. The method of claim 23, wherein one end of each of the electrical wires is shifted relative to the other end by an integer multiple of a pitch of the electrical wires.

29. The method of claim 21, wherein the electronics include an electronics system, the electronics system comprising:

a first voltage comparator configured to compare a voltage of the electrode to a first threshold;

a second voltage comparator configured to compare the voltage to a second threshold;

a counter configured to register a number of X-ray photons reaching the X-ray absorption layer,

a controller;

wherein the controller is configured to start a time delay from a time at which the first voltage comparator determines that an absolute value of the voltage equals or exceeds an absolute value of the first threshold;

wherein the controller is configured to activate the second voltage comparator during the time delay;

wherein the controller is configured to cause the number registered by the counter to increase by one, if the second voltage comparator determines that an absolute value of the voltage equals or exceeds an absolute value of the second threshold.