POWER SEMICONDUCTOR MODULE AND COOLER

• US 20170271240A1
• Filed: 05/30/2017
• Published: 09/21/2017
• Est. Priority Date: 06/17/2015
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: INOUE, Daisuke
• Granted Patent: US 10,304,756 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 25/07 the devices being of a type provided for in group H01L29/00
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

A power semiconductor module includes a laminate substrate; a semiconductor element joined to a front surface of the laminate substrate; a base plate 14 joined to a rear surface of the laminate substrate; a cooling case 15 which 15 has a heat sink 17, a bottom wall 15a, a side wall 15b formed around the bottom wall 15a, an inlet portion 15c and an outlet portion 15d for a cooling-liquid which are connected to either the bottom wall 15a or the side wall 15b, in which one end of the side wall 15b is joined to a rear surface of the base plate 14 such that a cooling liquid can flow into a space surrounded by the base plate 14, the bottom wall 15a, and the side wall 15b. The power semiconductor module further includes a spacer 20 between the inlet portion 15c and the outlet portion 15d.

Claims

1. A power semiconductor module comprising:

a laminate substrate;

a semiconductor element joined to a front surface of the laminate substrate;

a base plate joined to a rear surface of the laminate substrate;

a cooling case having a bottom wall and a side wall formed around the bottom wall, the cooling case having an inlet portion and an outlet portion for a cooling-liquid, the inlet portion and the outlet portion being connected to either the bottom wall or the side wall, one end of the side wall being joined to a rear surface of the base plate such that a cooling liquid can flow into a space surrounded by the base plate, the bottom wall, and the side wall; and

a heat sink housed in the cooling case, wherein

the power semiconductor module further includes a spacer between the inlet portion and the outlet portion of the cooling case.

2. The power semiconductor module according to claim 1, wherein

the spacer is arranged between the side wall in the vicinity of at least one of the inlet portion and the outlet portion, and the heat sink.

3. The power semiconductor module according to claim 2, wherein

the spacer is arranged adjacent to the heat sink from at least one of the inlet portion and the outlet portion to a corner part of the heat sink.

4. The power semiconductor module according to claim 1, wherein

the spacer is brazed to the base plate and the cooling case.

5. The power semiconductor module according to claim 1, wherein

the spacer is made of the same material as that of the base plate and the cooling case.

6. The power semiconductor module according to claim 1, wherein

the cooling case is manufactured by drawing.

7. The power semiconductor module according to claim 1, wherein

the heat sink is made of a wave-shaped or linear-shaped thin plate.

8. The power semiconductor module according to claim 1, wherein

the inlet portion has an inlet on a bottom surface, and the outlet portion has an outlet on a bottom surface.

9. The power semiconductor module according to claim 1, wherein

the cooling case has the inlet portion and the outlet portion on both ends of one side in a short direction of the cooling case.

10. The power semiconductor module according to claim 1, wherein

the cooling case has the inlet portion and the outlet portion on corner parts on a substantially diagonal line of the cooling case.

11. The power semiconductor module according to claim 1, wherein

the cooling case has the inlet portion and the outlet portion at the central parts of opposing sides in a long direction of the cooling case.

12. A cooler comprising:

a base plate;

a cooling case having a bottom wall and a side wall formed around the bottom wall, the cooling case having an inlet portion and an outlet portion for a cooling-liquid, the inlet portion and the outlet portion being connected to either the bottom wall or the side wall, one end of the side wall being joined to a rear surface of the base plate such that a cooling liquid can flow into a space surrounded by the base plate, the bottom wall, and the side wall; and

a heat sink housed in the cooling case, wherein

the cooler further includes a spacer between the inlet portion and the outlet portion of the cooling case.