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SEMICONDCUTOR PACKAGE AND MANUFACTURING PROCESS THEREOF

  • US 20170271248A1
  • Filed: 05/06/2016
  • Published: 09/21/2017
  • Est. Priority Date: 03/21/2016
  • Status: Active Application
First Claim
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1. A semiconductor package comprising:

  • a first redistribution layer;

    a first die, encapsulated within a molding material and coupled to the first redistribution layer;

    a second redistribution layer, disposed on the molding material on the first die and coupled to the first die, wherein the second redistribution layer comprises a topmost metallization layer having at least one contact pad, and the at least one contact pad includes a concave portion; and

    a surface coating layer, covering a portion of the topmost metallization layer and exposing the concave portion of the at least one contact pad.

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