MICRO PICK AND BOND ASSEMBLY
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Abstract
Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and-bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.
46 Citations
54 Claims
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1-33. -33. (canceled)
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34. A micro-pick-and-bond (μ
- PnB) assembly head, comprising;
a substrate; and a plurality of pedestals arrayed over a surface the substrate, wherein each pedestal comprises a base mechanically coupled to the substrate and a pressure sensitive adhesive (PSA) material at a tip of the pedestal opposite the substrate. - View Dependent Claims (35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46)
- PnB) assembly head, comprising;
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47. A crystalline LED display, comprising:
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a display interface including a plurality of metal interconnects; and a plurality of LED elements, wherein; each of the plurality of LED elements include a first metal electrode coupled to at least one of the metal interconnects; and at least one of the plurality of LED elements further includes a pressure sensitive adhesive (PSA) over a surface of the LED element opposite the first metal electrode. - View Dependent Claims (48)
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49. A micro-pick-and-bond (μ
- PnB) source substrate, comprising;
a carrier; and a plurality of device elements disposed over the carrier, wherein each device element further comprises; a device material stack an electrode between the device material stack and the carrier; and at least one of a pressure sensitive adhesive (PSA) material or a thermally decomposable material separated from the electrode by at least the device material stack. - View Dependent Claims (50, 51)
- PnB) source substrate, comprising;
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52. A micro-pick-and-bond (μ
- PnB) target substrate, comprising;
a plurality of die lands arrayed over the target substrate, each die land further comprising solder or an adhesive; and at least one mechanical stand-off adjacent to each of the die lands, the standoff having a z-height greater than a z-height of the die land added to a z-height of a die to be affixed to the land. - View Dependent Claims (53, 54)
- PnB) target substrate, comprising;
Specification