Intermediate Structure for Transfer, Method for Preparing Micro-device for Transfer, and Method for Processing Array of Semiconductor Device

• US 20170278760A1
• Filed: 03/25/2016
• Published: 09/28/2017
• Est. Priority Date: 03/25/2016
• Status: Active Grant

• Current Assignee: Mikro Mesa Technology Co., Ltd.
• Original Assignee: Mikro Mesa Technology Co., Ltd.
• Inventors: CHEN, Li-Yi, CHANG, Pei-Yu, CHAN, Chih-Hui, CHANG, Chun-Yi, LIN, Shih-Chyn, LEE, Hsin-Wei
• Granted Patent: US 9,842,782 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/67271 Sorting devices
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 22/14 for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
• CPC Class Codes: H01L 22/22 Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement testing and repair of stores after manufacture including at wafer scale G11C29/00; fuses per se H01L23/525
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other

Abstract

A method for preparing a plurality of micro-devices for transfer includes temporarily bonding the micro-devices onto a carrier substrate; testing the micro-devices on the carrier substrate to determine if there is at least one first failed micro-device in the micro-devices; and removing the first failed micro-device from the carrier substrate.

Claims

1. A method for preparing a plurality of micro-devices for transfer, the method comprising:

temporarily bonding the micro-devices onto a carrier substrate;

testing the micro-devices on the carrier substrate to determine if there is at least one first failed micro-device in the micro-devices; and

removing the first failed micro-device from the carrier substrate.

2. The method of claim 1, wherein the removing comprises:

debonding the micro-devices from the carrier substrate; and

addressably removing the first failed micro-device from the carrier substrate.

3. The method of claim 1, wherein the removing comprises:

debonding the first failed micro-device from the carrier substrate while leaving the other micro-device bonded on the carrier substrate; and

removing the debonded first failed micro-device.

4. The method of claim 1, further comprising:

transferring the remaining micro-devices from the carrier substrate to a receiving substrate after the removing.

5. The method of claim 4, wherein the transferring is performed by at least one transfer head capable of addressably picking at least one of the remaining micro-devices.

6. The method of claim 4, wherein the transferring is performed by at least one transfer head capable of non-addressably picking the remaining micro-devices.

7. The method of claim 4, wherein the transferring is performed by electrostatic chucking, adhesive chucking, or any combination thereof.

8. The method of claim 4, wherein the transferring comprises:

addressably transferring at least one of the remaining micro-devices from the carrier substrate to the receiving substrate; and

addressably transferring at least another of the remaining micro-devices from the carrier substrate to the receiving substrate.

9. The method of claim 4, further comprising:

acquiring at least one location of at least one micro-device void on the receiving substrate; and

patching the micro-device void on the receiving substrate with at least one patching micro-device.

10. The method of claim 9, further comprising:

storing at least one location of the first failed micro-device on the carrier substrate; and

determining the location of the micro-device void on the receiving substrate according to the location of the first failed micro-device on the carrier substrate.

11. The method of claim 4, further comprising:

testing the micro-devices on the receiving substrate to determine if there is at least one second failed micro-device on the receiving substrate; and

repairing the second failed micro-device on the receiving substrate with at least one repairing micro-device.

12-20. -20. (canceled)