FAN-OUT SEMICONDUCTOR PACKAGE
First Claim
1. A fan-out semiconductor package comprising:
- a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface;
an encapsulant encapsulating at least portions of the inactive surface of the semiconductor chip;
a first interconnection member disposed on the active surface of the semiconductor chip; and
a reinforcing layer disposed on the encapsulant,wherein the first interconnection member includes a redistribution layer electrically connected to the connection pads of the semiconductor chip.
2 Assignments
0 Petitions
Accused Products
Abstract
A fan-out semiconductor package includes: a fan-out semiconductor package may include: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip; and a reinforcing layer disposed on the encapsulant. The first interconnection member and the second interconnection member respectively include redistribution layers electrically connected to the connection pads of the semiconductor chip.
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Citations
39 Claims
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1. A fan-out semiconductor package comprising:
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a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the inactive surface of the semiconductor chip; a first interconnection member disposed on the active surface of the semiconductor chip; and a reinforcing layer disposed on the encapsulant, wherein the first interconnection member includes a redistribution layer electrically connected to the connection pads of the semiconductor chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 38, 39)
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31-37. -37. (canceled)
Specification