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FAN-OUT SEMICONDUCTOR PACKAGE

  • US 20170278766A1
  • Filed: 02/23/2017
  • Published: 09/28/2017
  • Est. Priority Date: 03/25/2016
  • Status: Active Grant
First Claim
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1. A fan-out semiconductor package comprising:

  • a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface;

    an encapsulant encapsulating at least portions of the inactive surface of the semiconductor chip;

    a first interconnection member disposed on the active surface of the semiconductor chip; and

    a reinforcing layer disposed on the encapsulant,wherein the first interconnection member includes a redistribution layer electrically connected to the connection pads of the semiconductor chip.

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