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Integrated System and Method of Making the Integrated System

  • US 20170278836A1
  • Filed: 06/09/2017
  • Published: 09/28/2017
  • Est. Priority Date: 08/02/2012
  • Status: Active Grant
First Claim
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1. A method for manufacturing an integrated device, the method comprising:

  • forming a first reconstitution wafer comprising first components;

    forming a second reconstitution wafer comprising second components;

    dicing the second reconstitution wafer into second packaged components, the second packaged components comprising the second components;

    placing the second packaged components on a first main surface of the first reconstitution wafer; and

    dicing the first reconstitution wafer into integrated devices, each integrated device comprising a first packaged component and a second packaged component.

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