COOLING APPARATUS HAVING VERTICAL FLOW CHANNELS

• US 20170280589A1
• Filed: 06/14/2017
• Published: 09/28/2017
• Est. Priority Date: 12/07/2012
• Status: Active Grant

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: TOCHIYAMA, Shigenobu, HAGA, Seiji, TAMURA, Masayoshi, ISHIBASHI, Satoshi, IDENOUE, Shinsuke
• Granted Patent: US 10,455,734 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20281 Thermal management, e.g. liquid flow control
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A liquid coolant supplying header is configured on a central portion in the width direction between an upper portion heatsink and a partitioning plate, a liquid coolant discharging header is configured on a central portion in the width direction between a lower portion heatsink and the partitioning plate so as to be parallel to the liquid coolant supplying header, vertical flow channels are formed so as to pass through the partitioning plate vertically on two sides in the width direction so as to be parallel to the liquid coolant supplying header, a liquid coolant distributing structural body is disposed inside the liquid coolant supplying header, and an external shape of the liquid coolant distributing structural body is formed such that flow channel cross-sectional area of the liquid coolant supplying header becomes gradually smaller from an upstream end toward a downstream end.

Claims

1. A cooling apparatus characterized in comprising:

a frame-shaped main body portion that has upper and lower openings;

an upper portion heatsink and a lower portion heatsink that are mounted above and below said main body portion so as to cover said upper and lower openings of said main body portion;

a partitioning plate that is disposed so as to divide an internal portion of said main body portion into upper and lower sections, so as to form an upper portion space with said upper portion heatsink, and so as to form a lower portion space with said lower portion heatsink;

a liquid coolant supplying header that is formed between said upper portion heatsink and said partitioning plate;

a liquid coolant discharging header that is formed between said lower portion heatsink and said partitioning plate so as to have a flow channel direction that is parallel to a flow channel direction of said liquid coolant supplying header;

a vertical flow channel that is separated from said liquid coolant supplying header by a predetermined distance in a width direction that is perpendicular to said flow channel directions, that passes through said partitioning plate vertically, that extends at least parallel to said flow channel direction of said liquid coolant supplying header, and that communicates between said upper portion space and said lower portion space; and

a liquid coolant distributing structural body that is disposed inside said liquid coolant supplying header, that is configured into a shape such that a flow channel cross-sectional area of said liquid coolant supplying header becomes gradually smaller from an upstream end toward a downstream end, and that distributes a liquid coolant that flows through said liquid coolant supplying header toward said vertical flow channel,

wherein the liquid coolant supplying header and the liquid coolant discharging header are two separate channels through which the liquid coolant flows, and

wherein a width t of said vertical flow channel satisfies 0.75 mm≦

t≦

6.5 mm.

2. A cooling apparatus according to claim 1, wherein said main body portion and said partitioning plate are configured into an integrated body.

3. A cooling apparatus according to claim 1, wherein said liquid coolant supplying header and said liquid coolant discharging header are disposed at a central portion in said width direction inside said main body portion, and two of said vertical flow channels are disposed on two sides in said width direction inside said main body portion.

4. A cooling apparatus according to claim 3, wherein, when said liquid coolant is flowing through at least one of said liquid coolant supplying header and said liquid coolant discharging header, a direction of flow of said liquid coolant that flows through said liquid coolant supplying header and a direction of flow of said liquid coolant that flows through said liquid coolant discharging header are identical directions.

5. A cooling apparatus according to claim 3, wherein a direction of flow of said liquid coolant that flows through said liquid coolant supplying header and a direction of flow of said liquid coolant that flows through said liquid coolant discharging header are opposite directions.

6. A cooling apparatus according to claim 1, wherein said liquid coolant supplying header and said liquid coolant discharging header are disposed on two sides in said width direction inside said main body portion, and said vertical flow channel is disposed centrally in said width direction inside said main body portion.

7. A cooling apparatus according to claim 6, wherein a direction of flow of said liquid coolant that flows through said liquid coolant supplying header and a direction of flow of said liquid coolant that flows through said liquid coolant discharging header are identical directions.

8. A cooling apparatus according to claim 6, wherein a direction of flow of said liquid coolant that flows through said liquid coolant supplying header and a direction of flow of said liquid coolant that flows through said liquid coolant discharging header are opposite directions.

9. A cooling apparatus according to claim 1, wherein said upper portion heatsink and said lower portion heatsink comprise groups of radiating fins that are housed in said upper portion space and said lower portion space.

10. A cooling apparatus according to claim 9, wherein a portion of a group of said radiating fins extend into at least one of said liquid coolant supplying header and said liquid coolant discharging header, and are formed such that fin height decreases gradually toward a central portion of said header.

11. A cooling apparatus according to claim 9, wherein said groups of said radiating fins are configured such that said radiating fins are arranged such that said liquid coolant meanders.

12. A cooling apparatus according to claim 1, wherein said partitioning plate is produced using a resin.

13. A cooling apparatus according to claim 1, wherein a side surface of said liquid coolant distributing structural body is constituted by a flat surface.

14. A cooling apparatus according to claim 1, wherein a side surface of said liquid coolant distributing structural body is constituted by a curved surface.