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Multi-Die Pressure Sensor Package

  • US 20170284880A1
  • Filed: 03/29/2016
  • Published: 10/05/2017
  • Est. Priority Date: 03/29/2016
  • Status: Active Grant
First Claim
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1. A pressure sensor package, comprising:

  • a substrate having an opening;

    a pressure sensor having a first side attached to the substrate and a second side opposite the first side, the first side having a pressure inlet aligned with the opening in the substrate, the second side having one or more electrical contacts;

    a logic die attached to an opposite side of the substrate as the pressure sensor and operable to process signals from the pressure sensor;

    first electrical conductors connected to the one or more electrical contacts of the pressure sensor;

    second electrical conductors connected to one or more electrical contacts of the logic die;

    a mold compound completely encapsulating the second electrical conductors and at least partly encapsulating the logic die and the first electrical conductors; and

    an open passage in the mold compound which is aligned with the opening in the substrate so as to define a pressure port of the pressure sensor package.

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