PROCESS FOR MANUFACTURING A MEMS PRESSURE SENSOR, AND CORRESPONDING MEMS PRESSURE SENSOR
First Claim
1. A process for manufacturing a MEMS pressure sensor, the process comprising:
- forming a buried cavity in a substrate of semiconductor material, the buried cavity forming a membrane that is suspended above the buried cavity;
forming, suspended above the membrane, a plate region made of conductive material and separated from the membrane by an empty space;
forming a fluidic-communication access channel providing fluidic communication between the membrane and an external environment; and
forming electrical-contact elements electrically coupled to the membrane and the plate region, wherein the membrane and the plate region form plates of a sensing capacitor.
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Accused Products
Abstract
A process for manufacturing a MEMS pressure sensor having a micromechanical structure envisages: providing a wafer having a substrate of semiconductor material and a top surface; forming a buried cavity entirely contained within the substrate and separated from the top surface by a membrane suspended above the buried cavity; forming a fluidic-communication access for fluidic communication of the membrane with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane, a plate region made of conductive material, separated from the membrane by an empty space; and forming electrical-contact elements for electrical connection of the membrane and of the plate region, which are designed to form the plates of a sensing capacitor, the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor having the micromechanical structure is moreover described.
7 Citations
20 Claims
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1. A process for manufacturing a MEMS pressure sensor, the process comprising:
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forming a buried cavity in a substrate of semiconductor material, the buried cavity forming a membrane that is suspended above the buried cavity; forming, suspended above the membrane, a plate region made of conductive material and separated from the membrane by an empty space; forming a fluidic-communication access channel providing fluidic communication between the membrane and an external environment; and forming electrical-contact elements electrically coupled to the membrane and the plate region, wherein the membrane and the plate region form plates of a sensing capacitor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 17)
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10. A MEMS pressure sensor comprising:
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a body including semiconductor material and having a top surface; a buried cavity contained within the body and separated from the top surface by a membrane, wherein the membrane is suspended above the buried cavity; a fluidic-communication access channel configured to provide fluidic communication between the membrane and an external environment; a plate region made of conductive material, the plate region suspended above the membrane and separated from the membrane by an empty space; and first and second electrical-contact elements configured to provide electrical connection to the membrane and the plate region, respectively, wherein the membrane and the plate region form a sensing capacitor. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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18. An electronic device comprising:
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an ASIC; and a MEMS pressure sensor coupled to the ASIC, the MEMS pressure sensor including; a body including semiconductor material; a buried cavity contained within the body; a membrane suspended over the buried cavity; a fluid access channel fluidically coupling the membrane with an external environment; a plate region suspended above the membrane and separated by the membrane by an empty space, the plate region being made of conductive material; a first electrical-contact element coupled to the membrane; and a second electrical-contact element coupled to the plate region, wherein the membrane and the plate region form a sensing capacitor. - View Dependent Claims (19, 20)
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Specification