COMMON MODE FILTER

• US 20170287619A1
• Filed: 10/05/2016
• Published: 10/05/2017
• Est. Priority Date: 03/31/2016
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: SIM, Won Chul, YOO, Young Seuck, BANG, Hye Won
• Granted Patent: US 10,468,176 B2
• Time in Patent Office: Days
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/04 with magnetic core
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 27/306 Fastening or mounting coils or windings on core, casing or other support

Abstract

A multilayer common mode filter includes: a body including a coil part having a plurality of spiral coils, wherein the coil part has one lead portion connected to one of external electrodes disposed on the body and one or more dummy lead portions each connected to the other external electrodes, and the lead portion is connected to dummy lead portions of other coil layers stacked in a thickness direction in series. Therefore, even though the common mode filter is miniaturized, the common mode filter may secure predetermined levels or more of performance and reliability.

Claims

1. A common mode filter comprising:

a body including a first magnetic body, a coil part disposed on the first magnetic body and including a plurality of coil layers including spiral coils and stacked in a thickness direction, and a second magnetic body disposed on the coil part; and

a plurality of external electrodes disposed on two surfaces of the body opposing each other so that the plurality of external electrodes face each other,

wherein one of the plurality of coil layers has a lead portion connected to one of the external electrodes and one or more dummy lead portions each connected to the other external electrodes, and

the lead portion of the one of the plurality of coil layers is connected to dummy lead portions of other coil layers stacked in the thickness direction in series.

2. The common mode filter of claim 1, wherein the external electrodes include first and third external electrodes disposed on one surface of the body so as to be spaced apart from each other and second and fourth external electrodes disposed on the other surface of the body so as to face the first and third external electrodes, respectively, and

the coil part includes first to fourth coil layers each having first and fourth lead portions respectively connected to the first to fourth external electrodes.

3. The common mode filter of claim 2, wherein the first to fourth external electrodes extend from one surface of the body onto portions of two surfaces of the body opposing each other in the thickness direction.

4. The common mode filter of claim 1, further comprising a plurality of conductive vias connecting the lead portion of the one of the plurality of coil layers to the dummy lead portions of the other coil layers stacked in the thickness direction.

5. The common mode filter of claim 4, wherein the conductive vias are formed by laser drilling.

6. The common mode filter of claim 4, wherein the conductive vias are exposed to one surface of the body to thereby be connected to the external electrode which the lead portion of the one of the plurality of coil layers is connected to.

7. A common mode filter comprising:

a body including a magnetic substrate, a coil part disposed on the magnetic substrate and including a plurality of spiral coils disposed to face each other in a thickness direction, and a magnetic body disposed on the coil part; and

a plurality of external electrodes disposed on two surfaces of the body opposing each other so as to face each other,

wherein the coil part has a lead portion connected to one of the external electrodes, and further has one or more dummy lead portions disposed on the same horizontal surface as a horizontal surface on which the lead portion is disposed so as to be respectively connected to the other external electrodes per coil, and the lead portion is connected to other dummy lead portions stacked to face the lead portion in the thickness direction in series.

8. The common mode filter of claim 7, wherein the external electrodes include first and third external electrodes disposed on one surface of the body so as to be spaced apart from each other and second and fourth external electrodes disposed on the other surface of the body so as to face the first and third external electrodes, respectively, and

the coil part includes first to fourth coil layers each having first and fourth lead portions respectively connected to the first to fourth external electrodes.

9. The common mode filter of claim 8, wherein the first to fourth external electrodes extending from one surface of the body onto portions of two surfaces of the body opposing each other in the thickness direction.

10. The common mode filter of claim 7, further comprising a plurality of conductive vias connecting each lead portion of the coil part to the other dummy lead portions disposed to face each lead portion in the thickness direction.

11. The common mode filter of claim 10, wherein the conductive vias are formed by a photo-resist process.

12. The common mode filter of claim 10, wherein the conductive vias are exposed to one surface of the body to thereby be connected to the external electrode which the lead portion is connected to.