VARIABLE BURIED OXIDE THICKNESS FOR SILICON-ON-INSULATOR DEVICES

• US 20170287935A1
• Filed: 03/31/2017
• Published: 10/05/2017
• Est. Priority Date: 03/31/2016
• Status: Abandoned Application

• Current Assignee: Skyworks Solutions Incorporated
• Original Assignee: Skyworks Solutions Incorporated
• Inventors: MASON, Jerod F., WHITEFIELD, David Scott, WANG, Hailing, FUH, Hanching
• Application Number:
  US15/476,248
• Publication Number:
  US 20170287935A1
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/8221 Three dimensional integrated circuits stacked in different levels
• CPC Class Codes: H01L 21/84 the substrate being other than a semiconductor body, e.g. being an insulating body
• CPC Class Codes: H01L 23/538 the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates H05K takes precedence; manufacture or treatment H01L21/4846 ; mountings per se H01L23/12; materials H01L23/49866
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 27/0688 Integrated circuits having a three-dimensional layout
• CPC Class Codes: H01L 27/1203 the substrate comprising an insulating body on a semiconductor body, e.g. SOI three-dimensional layout H01L27/0688
• CPC Class Codes: H01L 29/0649 Dielectric regions, e.g. SiO2 regions, air gaps

Abstract

Variable buried oxide thickness for silicon-on-insulator devices. In some embodiments, a radio-frequency device can include a silicon-on-insulator substrate having an insulator layer and a handle wafer. The radio-frequency device can further include a plurality of field-effect transistors implemented over the insulator layer. Each transistor can be separated from the handle wafer by a corresponding portion of the insulator layer. The corresponding portion of the insulator layer can have an average thickness value such that the average thickness values associated with the plurality of FETs transistors form a non-uniform distribution.

Claims

1. A radio-frequency device comprising:

a silicon-on-insulator substrate including an insulator layer and a handle wafer; and

a plurality of field-effect transistors implemented over the insulator layer, each transistor separated from the handle wafer by a corresponding portion of the insulator layer, the corresponding portion of the insulator layer having an average thickness value such that the average thickness values associated with the plurality of transistors form a non-uniform distribution.

2. The radio-frequency device of claim 1 wherein the non-uniform distribution of the average thickness values is selected to adjust a radio-frequency performance of some or all of the plurality of transistors.

3. The radio-frequency device of claim 2 wherein the insulator layer includes a buried oxide layer.

4. The radio-frequency device of claim 2 wherein the plurality of transistors are implemented in a stack configuration and arranged in series along a length direction between an input node and an output node.

5. The radio-frequency device of claim 4 wherein the non-uniform distribution is a function of the length direction.

6. The radio-frequency device of claim 5 wherein the non-uniform distribution includes a maximum average thickness associated with the first transistor adjacent the input node.

7. The radio-frequency device of claim 6 wherein the non-uniform distribution further includes a generally decreasing average thickness values such that the last transistor from the input node has a minimum average thickness value.

8. The radio-frequency device of claim 6 wherein the non-uniform distribution further includes a minimum average thickness value at a transistor that is between the first and last transistors from the input node.

9. The radio-frequency device of claim 2 wherein the plurality of transistors are implemented in a switch having a plurality of stacks, each stack having some of the plurality of transistors.

10. The radio-frequency device of claim 9 wherein the non-uniform distribution includes different average insulator thickness values among the plurality of stacks.

11. The radio-frequency device of claim 1 wherein the plurality of transistors are implemented over the handle wafer having a non-uniform distribution of resistivity.

12. The radio-frequency device of claim 11 wherein the non-uniform distribution of resistivity of the handle wafer is selected to adjust radio-frequency performance of some or all of the transistors.

13. A method for fabricating a radio-frequency device, the method comprising:

providing or forming a silicon-on-insulator substrate that includes an insulator layer and a handle wafer; and

forming a plurality of field-effect transistors over the insulator layer, such that each transistor is separated from the handle wafer by a corresponding portion of the insulator layer, the corresponding portion of the insulator layer having an average thickness value such that the average thickness values associated with the plurality of transistors form a non-uniform distribution.

14. The method of claim 13 wherein the insulator layer includes a buried oxide layer.

15. The method of claim 14 wherein the forming of the plurality of transistors includes forming a stack configuration such that the transistors are arranged in series along a length direction between an input node and an output node.

16. The method of claim 15 wherein the non-uniform distribution is a function of the length direction.

17. The method of claim 16 wherein the non-uniform distribution includes a maximum average thickness associated with the first transistor adjacent the input node.

18. The method of claim 17 wherein the non-uniform distribution further includes a generally decreasing average thickness values such that the last transistor from the input node has a minimum average thickness value.

19. The method of claim 17 wherein the non-uniform distribution further includes a minimum average thickness value at a transistor that is between the first and last transistors from the input node.

20. (canceled)

21. (canceled)

22. A radio-frequency module comprising:

a packaging substrate configured to receive a plurality of devices; and

a switching device mounted on the packaging substrate, the switching device including a silicon-on-insulator substrate having an insulator layer and a handle wafer, the switching device further including a plurality of field-effect transistors implemented over the insulator layer, each transistor separated from handle wafer by a corresponding portion of the insulator layer, the corresponding portion of the insulator layer having an average thickness value such that the average thickness values associated with the plurality of transistors form a non-uniform distribution.

23. (canceled)

24. (canceled)

25. (canceled)

26. (canceled)

27. (canceled)