PACKAGE METHOD AND PACKAGE
First Claim
1. A package comprising:
- a substrate;
a light emitting unit disposed on the substrate, the light emitting unit having a main light emitting surface; and
a molding compound disposed on the substrate and directly encapsulating the light emitting unit, the molding compound comprising a plurality of first phosphor particles and a plurality of second phosphor particles, an emission wavelength of the first phosphor particles being smaller than an emission wavelength of the second phosphor particles, the first phosphor particles in the molding compound having a first concentration per unit volume, the second phosphor particles in the molding compound having a second concentration per unit volume, the first concentration per unit volume being larger than the second concentration per unit volume at a position away from the main light emitting surface, the first concentration per unit volume being smaller than the second concentration per unit volume at a position close to the main light emitting surface.
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Accused Products
Abstract
A package method includes steps of providing a light emitting module, a mold and a molding compound, wherein the light emitting module includes a substrate and at least one light emitting unit disposed on the substrate, the mold has at least one recess, and a side wall of the recess is parallel to a side surface of the light emitting unit; filling the recess with the molding compound; placing the substrate on the mold reversely, so that the light emitting unit is immersed into the recess and the molding compound directly encapsulates the light emitting unit; and heating and pressing the substrate and the mold, so as to solidify the molding compound.
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Citations
11 Claims
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1. A package comprising:
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a substrate; a light emitting unit disposed on the substrate, the light emitting unit having a main light emitting surface; and a molding compound disposed on the substrate and directly encapsulating the light emitting unit, the molding compound comprising a plurality of first phosphor particles and a plurality of second phosphor particles, an emission wavelength of the first phosphor particles being smaller than an emission wavelength of the second phosphor particles, the first phosphor particles in the molding compound having a first concentration per unit volume, the second phosphor particles in the molding compound having a second concentration per unit volume, the first concentration per unit volume being larger than the second concentration per unit volume at a position away from the main light emitting surface, the first concentration per unit volume being smaller than the second concentration per unit volume at a position close to the main light emitting surface. - View Dependent Claims (2, 3, 4, 5)
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6. A package comprising:
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at least one light emitting unit having a main light emitting surface; and a molding compound directly encapsulating the light emitting unit, wherein the molding compound has a plurality of first phosphor particles and a plurality of second phosphor particles, and an emission wavelength of the first phosphor particles is smaller than an emission wavelength of the second phosphor particles, wherein the first phosphor particles in the molding compound has a first concentration per unit volume, and the first concentration per unit volume at a first position away from the main light emitting surface is larger than the first concentration per unit volume at a second position that is closer to the main light emitting surface than the first position. - View Dependent Claims (7, 8, 9, 10, 11)
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Specification