METHOD OF MANUFACTURING LIGHT EMITTING ELEMENT MOUNTING BASE MEMBER, METHOD OF MANUFACTURING LIGHT EMITTING DEVICE USING THE LIGHT EMITTING ELEMENT MOUNTING BASE MEMBER, LIGHT EMITTING ELEMENT MOUNTING BASE MEMBER, AND LIGHT EMITTING DEVICE USING THE LIGHT EMITTING ELEMENT MOUNTING BASE MEMBER

• US 20170288107A1
• Filed: 03/31/2017
• Published: 10/05/2017
• Est. Priority Date: 04/01/2016
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: MARUTANI, Yukitoshi
• Granted Patent: US 10,644,210 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 23/4922 having a heterogeneous or anisotropic structure
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/13 the devices being of a type provided for in group H01L33/00
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01S 5/02315 Support members, e.g. bases or carriers
• CPC Class Codes: H01S 5/0233 Mounting configuration of laser chips
• CPC Class Codes: H01S 5/0235 Method for mounting laser chips

Abstract

A method of manufacturing a light emitting element mounting base member includes: providing a first insulating member in a plate shaped having at least one recess portion or at least one through-hole; disposing in the recess portion or in the through-hole a light blocking resin and a plurality of core members each equipped with a second insulating member having light reflectivity on each surface of a plurality of electrical conductor cores; and exposing at least one of the surface of the electrical conductor cores from the second insulating members by removing each part of at least one of the second insulating members.

Claims

1. A method of manufacturing a light emitting element mounting base member, the method comprising:

providing a first insulating member in a plate shape having at least one recess portion or at least one through-hole;

disposing in the recess portion or in the through-hole a light blocking resin and a plurality of core members each equipped with a light-reflecting second insulating member provided on each surface of a plurality of electrical conductor cores; and

exposing at least one of the surface of the electrical conductor cores from the second insulating members by removing each part of at least one of the second insulating members.

2. The method of manufacturing a light emitting element mounting base member according to claim 1, further comprising

disposing at least one of metal film on at least one of the surfaces of the electrical conductor cores that is exposed from the second insulating members.

3. The method of manufacturing a light emitting element mounting base member according to claim 1, further comprising

squashing upper surfaces and/or lower surfaces of the core members before the step of exposing the surface of the electrical conductor core.

4. The method of manufacturing a light emitting element mounting base member according to claim 1,

wherein the step of exposing the surface of the electrical conductor core includes covering the region, that the second insulating member is removed from, using the light blocking resin.

5. The method of manufacturing a light emitting element mounting base member according to claim 1,

wherein the step of exposing the surface of the electrical conductor core includes removing the second insulating member using a solvent.

6. The method of manufacturing a light emitting element mounting base member according to claim 1, further comprising

cutting the first insulating member.

7. A method of manufacturing a light emitting device, further comprising

mounting at least one light emitting element on the light emitting element mounting base member manufactured by the method according to claim 1.

8. A light emitting element mounting base member comprising:

a plurality of electrical conductor cores;

a light-reflecting second insulating member that covers at least one lateral surface of each of the electrical conductor cores;

a light blocking resin that joins the at least two second insulating members; and

a first insulating member that is in contact with the at least one light blocking resin,

wherein at least one upper surface of the electrical conductor cores and at least one lower surface of the electrical conductor cores are exposed from the light blocking resin.

9. The light emitting element mounting base member according to claim 8, further comprising

a metal film on at least one surface of the electrical conductor cores.

10. The light emitting element mounting base member according to claim 8,

wherein at least two of the electrical conductor cores are electrically connected by a metal film.

11. A light emitting device comprising:

the light emitting element mounting base member according to claim 8; and

at least one light emitting element mounted on the light emitting element mounting base member and electrically connected to the electrical conductor cores.

12. The light emitting device according to claim 11,

wherein the light emitting element includes positive and negative electrodes on a surface closer to the light emitting element mounting base member, and at least two of the electrical conductor cores are electrically connected to the positive and negative electrodes of the light emitting element.