WIRING BOARD, ELECTRIC MOTOR, ELECTRIC APPARATUS, AND AIR CONDITIONER
1 Assignment
0 Petitions
Accused Products
Abstract
An object of the present invention is to obtain a wiring board that achieves both of high mounting position accuracy and high solder strength in a circumferential direction. On the wiring board, an electronic component including a plurality of pins is mounted. The wiring board includes a base substrate, a plurality of wires provided on the base substrate, a resist covering the wires, and a plurality of footprints connected to the wires and having entire surfaces exposed in openings of the resist. The pins are soldered to the footprints by reflow. In the openings of the resist, directions in which the pins are led out are parallel to directions in which the wires are led out.
13 Citations
28 Claims
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1-11. -11. (canceled)
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12. A wiring board on which an electronic component to detect a magnetic-pole rotational position of a rotor is mounted, the electronic component including a pin, the wiring board comprising:
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a base substrate having an origin on an axis of rotation of the rotor; a wire provided on the base substrate; a resist covering the wire; and a footprint connected to the wire, the pin being soldered to the footprint, wherein a direction in which the wire at a connection between the footprint and the wire is led out is parallel to a direction in which the pin is led out, and the direction in which the pin is led out is a direction inclined at 45 degrees or less relative to a straight line interconnecting the origin and the electronic component on the base substrate. - View Dependent Claims (15, 17, 19, 21, 23, 25, 27)
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13. A wiring board on which an electronic component to detect a magnetic-pole rotational position of a rotor is mounted, the electronic component including a pin, the wiring board comprising:
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a base substrate having an origin on an axis of rotation of the rotor; a wire provided on the base substrate; a resist covering the wire; and a footprint connected to the wire, the pin being soldered to the footprint, wherein a direction in which the wire at a connection between the footprint and the wire is led out is parallel to a direction in which the pin is led out, the pin has a bent portion bent in a thickness direction of the electronic component, and a distance from an end portion of the resist defining an opening to a base point of the bent portion of the pin is larger than a height from a surface of the footprint to a base point from which the pin is led out from the electronic component. - View Dependent Claims (14, 16, 18, 20, 22, 24, 26, 28)
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Specification