Please download the dossier by clicking on the dossier button x
×

SURFACE-MOUNTABLE POWER DELIVERY BUS BOARD

  • US 20170290158A1
  • Filed: 03/30/2016
  • Published: 10/05/2017
  • Est. Priority Date: 03/30/2016
  • Status: Active Grant
First Claim
Patent Images

1. An integrated circuit (IC) device assembly, comprising:

  • a primary printed circuit board (PCB) further including;

    first front-side pads disposed within a first front-side region of the primary PCB;

    second front-side pads disposed within a second front-side region of the primary PCB;

    first back-side pads disposed within a first back-side region, opposite the first front-side region, wherein the first back-side pads are electrically coupled through the primary PCB to the first front-side pads; and

    second back-side pads disposed within a second back-side region, opposite the second front-side region, wherein the second back-side pads are electrically coupled through the primary PCB to a first portion of the second front-side pads; and

    a secondary PCB mounted to a back side of the primary PCB, the secondary PCB bridging a length between the first and second back-side regions and comprising two or more layers of conductive traces electrically coupling the first and second back-side pads.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×