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DC Magnetron Sputtering

  • US 20170294294A1
  • Filed: 04/04/2017
  • Published: 10/12/2017
  • Est. Priority Date: 04/11/2016
  • Status: Active Grant
First Claim
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1. A DC magnetron sputtering apparatus for depositing a film on a substrate comprising:

  • a chamber;

    a substrate support positioned within the chamber;

    a DC magnetron; and

    an electrical signal supply device for supplying an electrical bias signal that, in use, causes ions to bombard a substrate positioned on the substrate support;

    in which the substrate support comprises a central region surrounded by an edge region, the central region being raised with respect to the edge region.

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