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SEMICONDUCTOR PACKAGE STRUCTURE, PACKAGE ON PACKAGE STRUCTURE AND PACKAGING METHOD

  • US 20170294389A1
  • Filed: 04/07/2017
  • Published: 10/12/2017
  • Est. Priority Date: 04/07/2016
  • Status: Active Grant
First Claim
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1. A semiconductor package structure, comprising:

  • a substrate having a first surface and a second surface opposite to the first surface and a first coefficient of thermal expansion CTE1;

    a first semiconductor device disposed adjacent to the first surface of the substrate;

    a first encapsulant disposed on the first surface of the substrate, covering at least a portion of the first semiconductor device, and having a second coefficient of thermal expansion CTE2; and

    a second encapsulant disposed on the second surface of the substrate and having a third coefficient of thermal expansion CTE3,wherein a difference between CTE1 and CTE2 is substantially equal to a difference between CTE1 and CTE3.

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