Corrugated Package for Microelectromechanical System (MEMS) Device

• US 20170297905A1
• Filed: 04/14/2016
• Published: 10/19/2017
• Est. Priority Date: 04/14/2016
• Status: Active Grant

• Current Assignee: Akustica Incorporated, Robert Bosch GmbH
• Original Assignee: Akustica Incorporated, Robert Bosch GmbH
• Inventors: Saxena, Kuldeep
• Granted Patent: US 10,442,683 B2
• Time in Patent Office: Days
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 7/0041 maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: B81C 1/00333 Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/0163 Reinforcing a cap, e.g. with ribs

Abstract

A MEMS device package assembly for encapsulating one or more internal components includes a first MEMS device package. The first package includes a cover and a substrate attached to the cover by any suitable methods of attachment. A corrugated structure is formed on at least one of an inner or outer wall of the cover. The assembly further includes a second MEMS device package having a cover, a substrate, and a corrugated structured formed on at least one of an inner or outer wall of the cover. The first and second MEMS device packages may be coupled to the same substrate or different substrate. In another embodiment, the first MEMS device package may be mounted on the second MEMS device package. In yet another embodiment, the first MEMS device package may be contained in the second MEMS device package.

Claims

1. A microelectromechanical system (MEMS) device package comprising:

a substrate having a first surface and second surface;

a cover having an inner region and an outer region, the cover is coupled to the substrate and defines a cavity between the inner region and the substrate;

at least one device disposed within the cavity; and

an acoustic port defined in one of the substrate and the cover and connecting the cavity to an external environment,

wherein a corrugated structure is formed on at least one of the inner region and the outer region.

2. The MEMS device package of claim 1 wherein the inner region comprises an inner wall and the inner wall is the corrugated structure.

4. The MEMS device package of claim 1 wherein the cavity comprises a first volume and the corrugated structure is formed as a portion of the inner region and is located within the first volume.

5. The MEMS device package of claim 1 wherein the cover further comprises a common region, which divides the cavity into a first volume and a second volume.

6. The MEMS device package of claim 5 wherein the corrugated structure is defines at least one of the first and second volumes.

8. The MEMS device package of claim 1 wherein the acoustic port is formed in the substrate.

9. The MEMS device package of claim 1 wherein the acoustic port is formed in the cover.

10. The MEMS device package of claim 1 wherein the device is selected from a group consisting of a MEMS transducer, a semiconductor device, a speaker, a receiver, a microphone, a pressure sensor, a thermal sensor, an optical sensor, an imaging sensor, a chemical sensor, a gyroscope, an accelerometer, a gas sensor, an environmental sensor, a motion sensor, a navigation sensor, an integrated circuit, an ASIC, a processor, a controller, and an energy storage device.

24. The MEMS device package of claim 1, wherein the cover includes a plurality of side walls and an outer wall, and the corrugated structure is formed on at least one of the plurality of side walls.

25. The MEMS device package of claim 24, wherein the corrugated structure is formed on each side wall of the plurality of side walls.

26. The MEMS device package of claim 24, wherein the corrugated structure is further formed on the outer wall.

27. The MEMS device package of claim 1, wherein the corrugated structure includes a top portion and a plurality of U-shaped grooves formed in the top portion.

28. The MEMS device package of claim 27, wherein the U-shaped grooves each include protrusions formed on both sides of the U-shaped grooves.

29. The MEMS device package of claim 1, wherein the corrugated structure includes a top portion and a plurality of trenches formed in the top portion, each pair of trenches being separated by a sharp point at the top portion.

30. The MEMS device package of claim 1, wherein the corrugated structure includes a top portion and a plurality of trenches formed in the top portion, each trench having a semicircle shape.

31. The MEMS device package of claim 1, wherein the corrugated structure includes a top portion and a plurality of V-shaped grooves.

32. The MEMS device package of claim 5 wherein the first and second volumes are isolated from one another.

33. The MEMS device package of claim 5 wherein the corrugated structure includes a first corrugated structure defining the first volume and a second corrugated structure defining the second volume.

34. The MEMS device package of claim 5, wherein the common region includes the corrugated structure.

3. A microelectromechanical system (MEMS) device package comprising:

a substrate having a first surface and second surface;

a cover having an inner region and an outer region, the cover is coupled to the substrate and defines a cavity between the inner region and the substrate; and

at least one device disposed within the cavity,

wherein the outer region comprises an outer wall, and the outer wall includes a corrugated structure.

7. The MEMS device package of claim 3 further comprising an acoustic port defined in one of the substrate and the cover and connecting the cavity to an external environment.

11. The MEMS device package of claim 3 wherein the package is hermitically sealed.

12-23. -23. (canceled)

35. A microelectromechanical system (MEMS) device package comprising:

a substrate having a first surface and second surface;

a cover having an inner region and an outer region, the cover coupled to the substrate and defining a cavity between the inner region and the substrate, the cover including a plurality of side walls and an outer wall; and

at least one device disposed within the cavity,

wherein a corrugated structure is formed on the inner region on at least one of the plurality of side walls.