POLISHING COMPOSITION AND POLISHING METHOD
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Abstract
There are provided a polishing composition and a method for polishing capable of, when a substrate including polysilicon is polished, limiting the polishing rate of the polysilicon, and selectively polishing a silicon compound other than the polysilicon, such as silicon nitride. The polishing composition used includes abrasives, an organic acid and a conjugate base of the organic acid.
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Citations
31 Claims
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1-11. -11. (canceled)
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12. A polishing composition comprising:
- abrasives, an organic acid and a conjugate base of the organic acid.
- View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
Specification