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RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE

  • US 20170299965A1
  • Filed: 10/01/2015
  • Published: 10/19/2017
  • Est. Priority Date: 10/06/2014
  • Status: Abandoned Application
First Claim
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1. A resin composition which is configured such that, when the resin composition is formed into a resin composition film that has a thickness of 3.0 μ

  • m after a heat treatment at a temperature within the range from 200 to 350°

    C., the resin composition film forms a heat-resistant resin film having a light transmittance of 50% or more at a wavelength of 365 to 436 nm before the heat treatment and having a light transmittance of 10% or less at a wavelength of 365 to 436 nm after the heat treatment.

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