RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE

• US 20170299965A1
• Filed: 10/01/2015
• Published: 10/19/2017
• Est. Priority Date: 10/06/2014
• Status: Abandoned Application

• Current Assignee: Toray Industries Incorporated
• Original Assignee: Toray Industries Incorporated
• Inventors: HASHIMOTO, Keika, MIYOSHI, Kazuto, TOMIKAWA, Masao
• Application Number:
  US15/517,093
• Publication Number:
  US 20170299965A1
• Time in Patent Office: Days
• CPC Class Codes: C08L 101/02 characterised by the presence of specified groups , e.g. terminal or pendant functional groups
• CPC Class Codes: C09D 179/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: G03F 7/0046 with perfluoro compounds, e.g. for dry lithography G03F7/0048 takes precedence
• CPC Class Codes: G03F 7/0226 characterised by the non-macromolecular additives
• CPC Class Codes: G03F 7/0233 characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
• CPC Class Codes: G03F 7/0236 Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
• CPC Class Codes: G03F 7/037 the binders being polyamides or polyimides
• CPC Class Codes: G03F 7/0387 Polyamides or polyimides
• CPC Class Codes: G03F 7/40 Treatment after imagewise removal, e.g. baking
• CPC Class Codes: H01L 21/027 Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 photographic masks or originals per se G03F1/00; registration or positioning of photographic masks or originals G03F9/00; photographic cameras G03B; control of position G05D3/00
• CPC Class Codes: H01L 29/786 Thin film transistors, i.e. transistors with a channel being at least partly a thin film transistors having only the source or the drain region on an insulator layer H01L29/0653; thin film FinFETs H01L29/785
• CPC Class Codes: H10K 50/87 Arrangements for heating or cooling
• CPC Class Codes: H10K 59/122 Pixel-defining structures or layers, e.g. banks
• CPC Class Codes: H10K 59/124 Insulating layers formed between TFT elements and OLED elements
• CPC Class Codes: H10K 59/8794 Arrangements for heating and cooling

Abstract

A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 μm after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices.

Claims

1. A resin composition which is configured such that, when the resin composition is formed into a resin composition film that has a thickness of 3.0 μ

m after a heat treatment at a temperature within the range from 200 to 350°

C., the resin composition film forms a heat-resistant resin film having a light transmittance of 50% or more at a wavelength of 365 to 436 nm before the heat treatment and having a light transmittance of 10% or less at a wavelength of 365 to 436 nm after the heat treatment.

2. The resin composition according to claim 1, wherein, when the resin composition is formed into a resin composition film having a thickness of 2.0 μ

m after a heat treatment at a temperature within the range from 200 to 350°

C., the resin composition film forms a heat-resistant resin film having a light transmittance of 50% or more at a wavelength of 365 to 436 nm before the heat treatment and having a light transmittance of 5% or less at a wavelength of 350 to 460 nm after the heat treatment.

3. The resin composition according to claim 1, additionally containing a photo-acid generator and having positive-working photosensitivity.

20. A method for producing a heat-resistant resin film, comprising the steps of:

applying a resin composition as recited in claim 1 onto a substrate to form a coating film;

drying the coating film;

exposing the dried photosensitive resin film to light;

developing the light-exposed photosensitive resin film; and

subjecting the developed photosensitive resin film to a heat treatment.

21. A method for producing a heat-resistant resin film, comprising the steps of:

applying a resin composition as recited in claim 1 onto a substrate using a slit nozzle to form a coating film; and

drying the coating film under reduced pressure to form a photosensitive resin film.

22. A display device comprising a substrate, a first electrode which is formed on the substrate, an insulating layer which is formed on the first electrode in such a manner as to allow the first electrode to be partially exposed to light, and a second electrode which is provided opposed to the first electrode, wherein the insulating layer is a heat-resistant resin film produced by a production method as recited in claim 20.

23. A display device comprising a substrate on which thin film transistors (TFTs) are formed, a planarization film which is provided in such a manner as to cover projections and depressions on the substrate, and display elements which are provided on the planarization film, wherein the planarization film is a heat-resistant resin film produced by a production method as recited in claim 20.

24. A display device comprising a substrate on which oxide TFTs are formed as thin film transistors (TFTs), a planarization film which is provided in such a manner as to cover projections and depressions on the substrate, and display elements which are provided on the planarization film, wherein the planarization film is a heat-resistant resin film produced by a production method as recited in claim 20.

25. The display device according to claim 23, wherein the degree of resolution of each of the display elements is 200 ppi or more.

4. A resin composition having positive-working photosensitivity and comprising (A1) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (A3) a phenolic resin and/or a polyhydroxystyrene resin, (B) a thermally color-developing compound, (C) a photo-acid generator, and (D) a solvent, wherein the component (A3) is contained in an amount of 5 to 50 parts by weight inclusive relative to 100 parts by weight of the component (A1).

6. The resin composition according to claim 4, wherein the thermally color-developing compound (B) is a hydroxy-group-containing compound having a triarylmethane backbone.

7. The resin composition according to claim 4, additionally containing (E) a dye and/or a pigment.

8. The resin composition according to claim 4, additionally containing (F) a compound having 3 to 6 thermally crosslinkable groups per molecule.

5. A resin composition having positive-working photosensitivity and comprising (A2) a resin having such a backbone structure that two cyclic structures are bonded to a cyclic-structure-constituting quaternary carbon atom, (A3) a phenolic resin and/or a polyhydroxystyrene resin, (B) a thermally color-developing compound, (C) a photo-acid generator, and (D) a solvent, wherein the component (A3) is contained in an amount of 5 to 50 parts by weight inclusive relative to 100 parts by weight of the component (A2).

9. A resin composition having positive-working photosensitivity and comprising (A) an alkali-soluble resin, (I) a compound whose maximum absorption wavelength shifts by a heat treatment, (C) a photo-acid generator, and (D) a solvent.

10. The resin composition having positive-working photosensitivity according to claim 9, wherein the alkali-soluble resin (A) is a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor.

11. The resin composition having positive-working photosensitivity according to claim 9, wherein the alkali-soluble resin (A) comprises at least one alkali-soluble resin selected from:

a resin having such a backbone structure that two cyclic structures are bonded to a cyclic-structure-constituting quaternary carbon atom; and

a phenolic resin and/or a polyhydroxystyrene resin.

12. The resin composition having positive-working photosensitivity according to claim 9, wherein the compound (I) whose maximum absorption wavelength shifts by a heat treatment has a maximum absorption wavelength of 340 nm or more and less than 450 nm after a heat treatment.

13. The resin composition having positive-working photosensitivity according to claim 9, wherein the compound (I) whose maximum absorption wavelength shifts by a heat treatment is a compound which has one or more phenolic hydroxyl groups and in which one, several or all of the phenolic hydroxyl groups are respectively protected by protecting groups.

14. The resin composition having positive-working photosensitivity according to claim 13, wherein the compound (I) whose maximum absorption wavelength shifts by a heat treatment has one or more phenolic hydroxyl groups and each of the protecting groups which respectively protect one, several or all of the phenolic hydroxyl groups is a heat-labile group or an acid-labile group.

15. The resin composition having positive-working photosensitivity according to claim 14, wherein the compound (I) whose maximum absorption wavelength shifts by a heat treatment has one or more phenolic hydroxyl groups and a heat-labile group or an acid-labile group which protects each of one, several or all of the phenolic hydroxyl groups is represented by any one of general formula (8) to (11):

16. The resin composition having positive-working photosensitivity according to claim 9, wherein the compound (I) whose maximum absorption wavelength shifts by a heat treatment is a non-condensed polycyclic compound or a condensed polycyclic compound.

17. The resin composition having positive-working photosensitivity according to claim 9, wherein the compound (I) whose maximum absorption wavelength shifts by a heat treatment is a non-condensed polycyclic compound or a condensed polycyclic compound each having 2 to 8 inclusive of aromatic rings.

18. The resin composition having positive-working photosensitivity according to claim 9, additionally containing (J) a compound which does not have an absorption maximum at a wavelength of 340 nm or more and less than 436 nm and has an absorption maximum at a wavelength of 436 to 750 nm inclusive.

19. The resin composition having positive-working photosensitivity according to claim 9, additionally containing (F) a compound having 3 to 6 thermally crosslinkable groups per molecule.