INTERFACES AND DIE PACKAGES, AND APPARTUSES INCLUDING THE SAME
First Claim
1. An apparatus, comprising:
- a die package including multiple groups of circuits; and
an interface configured to divide a channel between the die package and a controller into multiple channels in response to an external control signal, with at least one channel corresponding to each circuit of the multiple groups of circuits.
6 Assignments
0 Petitions
Accused Products
Abstract
A memory device includes a memory die package including a plurality of memory dies, an interface device including an interface circuit, and a memory controller configured to control the interface with control data received from at least one of the plurality of memory dies. The interface device of the memory device is configured to divide and multiplex an IO channel between the memory die package and the memory controller into more than one channel using the control data receive from the at least one of the plurality of memory dies. The interface device for a memory device includes a control input buffer configured to receive an enable signal through a control pad, a first input buffer configured to receive a first data through a first IO pad in response to a first state of the enable signal, and a second input buffer configured to receive a second data through a second IO pad in response to a second state of the enable signal. The interface device further includes an input multiplexer configured to multiplex the first data and the second data to provide an input data.
4 Citations
1 Claim
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1. An apparatus, comprising:
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a die package including multiple groups of circuits; and an interface configured to divide a channel between the die package and a controller into multiple channels in response to an external control signal, with at least one channel corresponding to each circuit of the multiple groups of circuits.
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Specification