SYSTEM AND METHOD FOR COOLING POWER ELECTRONICS
First Claim
Patent Images
1. A cooling system for power electronics, comprising:
- at least one power electronics component;
a liquid chamber in thermal communication with the frame of an engine-powered unit; and
a pump configured to circulate a cooling fluid through the at least one power electronics component and the liquid chamber;
wherein the liquid chamber is configured to conductively transfer heat from the cooling fluid to the frame.
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Abstract
A cooling system for power electronics of an engine-powered unit includes at least one power electronics component, a liquid chamber in thermal communication with a frame of the engine-powered unit, and a pump configured to circulate a cooling fluid through the at least one power electronics component and the liquid chamber. The liquid chamber is configured to conductively transfer heat from the cooling fluid to the frame to cool the cooling fluid.
23 Citations
27 Claims
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1. A cooling system for power electronics, comprising:
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at least one power electronics component; a liquid chamber in thermal communication with the frame of an engine-powered unit; and a pump configured to circulate a cooling fluid through the at least one power electronics component and the liquid chamber; wherein the liquid chamber is configured to conductively transfer heat from the cooling fluid to the frame. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A cooling system for power electronics, comprising:
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a power electronics cooling loop having a first fluid configured for circulation through at least one power electronics component of an engine-powered unit; and a heat rejection loop having a second fluid configured for circulation through at least at least one liquid chamber, the liquid chamber being in thermal communication with a frame of the engine-powered unit; wherein the power electronics cooling loop is fluidly isolated from, and in thermal communication with, the heat rejection loop. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15)
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16-23. -23. (canceled)
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24. An apparatus for cooling power electronics, comprising:
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a liquid chamber configured for selective mounting to a frame of an engine-powered unit; an inlet in the liquid chamber, the inlet being configured to receive a cooling fluid from at least one power electronics component; and an outlet in the liquid chamber, the outlet being configured to direct the cooling fluid in the liquid chamber to a cooling loop in fluid communication with the at least one power electronics component; wherein the liquid chamber is configured to dissipate heat from the cooling fluid through the frame of the engine-powered unit. - View Dependent Claims (25, 26, 27)
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Specification