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SYSTEM AND METHOD FOR COOLING POWER ELECTRONICS

  • US 20170311490A1
  • Filed: 11/18/2015
  • Published: 10/26/2017
  • Est. Priority Date: 11/18/2014
  • Status: Active Grant
First Claim
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1. A cooling system for power electronics, comprising:

  • at least one power electronics component;

    a liquid chamber in thermal communication with the frame of an engine-powered unit; and

    a pump configured to circulate a cooling fluid through the at least one power electronics component and the liquid chamber;

    wherein the liquid chamber is configured to conductively transfer heat from the cooling fluid to the frame.

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