HEAT DISSIPATING STRUCTURE AND WATER-COOLING HEAT DISSIPATING APPARATUS INCLUDING THE STRUCTURE

• US 20170314870A1
• Filed: 04/30/2016
• Published: 11/02/2017
• Est. Priority Date: 04/30/2016
• Status: Abandoned Application

• Current Assignee: Taiwan Microloops Corp.
• Original Assignee: Taiwan Microloops Corp.
• Inventors: LIN, Chun-Hung
• Application Number:
  US15/143,509
• Publication Number:
  US 20170314870A1
• Time in Patent Office: Days
• CPC Class Codes: F28D 15/00 Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies F28D17/00, F28D19/00, F28D20/00 take precedence
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 15/0283 Means for filling or sealing heat pipes
• CPC Class Codes: F28D 15/04 with tubes having a capillary structure
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28F 1/32 the means having portions engaging further tubular elements
• CPC Class Codes: F28F 3/06 the means being attachable to the element
• CPC Class Codes: F28F 3/08 Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence

Abstract

A heat dissipating structure and a water-cooling heat dissipating apparatus including the structure are disclosed. The heat dissipating structure includes a vapor chamber, plural heat pipes and a heat dissipating member, and the vapor chamber has a hollow slot penetrating through the vapor chamber, and the vapor chamber also has a cavity. Each heat pipe is vertically installed to the vapor chamber and communicated with the cavity. The heat dissipating member includes a substrate and plural fins integrally extended from the substrate and seals the hollow slot by a substrate, so as to improve the thermal conduction and dissipation of the heat dissipating structure and the water-cooling heat dissipating apparatus.

Claims

1. A heat dissipating structure, comprising:

a vapor chamber, having a hollow slot penetrating through the vapor chamber, and a cavity formed in the vapor chamber;

a plurality of heat pipes, installed in the vapor chamber and communicated with the cavity; and

a heat dissipating member, including a substrate and a plurality of fins integrally extended from the substrate, and the heat dissipating member sealing the hollow slot by the substrate.

2. The heat dissipating structure according to claim 1, wherein the substrate has a bottom side, and the vapor chamber has a heated surface, and the bottom side of the substrate and the heated surface of the vapor chamber form a common surface structure.

3. The heat dissipating structure according to claim 2, further comprising a plurality of heat dissipating fins having a plurality of through holes configured to be corresponsive to each other respectively, and each through hole having a circular wall extended from the periphery of the through hole, and each heat dissipating fin being coupled to each heat pipe through each through hole, and the heat dissipating fins being stacked and coupled to each other through the circular wall, such that a liquid channel is formed between any two adjacent heat dissipating fins.

4. The heat dissipating structure according to claim 2, wherein the hollow slot is formed at a middle area of the vapor chamber.

5. The heat dissipating structure according to claim 4, wherein the vapor chamber installed at the external periphery of the hollow slot has an upper receiving section disposed at the top of the vapor chamber, and the substrate includes a base section, a vertical plate section bent and extended upwardly and separately from both sides of the base section, and a bridging section bent and extended from the vertical plate section in a horizontal direction, and the bottom side is formed outside the base section, and the base section seals the bottom of the hollow slot, and each bridging section is attached to each respective upper receiving section.

6. The heat dissipating structure according to claim 5, wherein each vertical plate section is attached to an inner wall of the respective hollow slot.

7. The heat dissipating structure according to claim 5, wherein each fin is formed with an interval apart from the base section and each bridging section by extruding or chipping.

8. The heat dissipating structure according to claim 4, wherein the vapor chamber installed at the external periphery of the hollow slot has a lower receiving section disposed at the bottom of the vapor chamber, and the substrate includes a base section and a bridging section extended from both sides of the base section in a horizontal direction, and the bottom side is formed outside the base section, and the base section seals bottom of the hollow slot, and each bridging section is attached to each respective lower receiving section.

9. The heat dissipating structure according to claim 4, wherein the substrate includes a base section, and the bottom side is formed outside the base section, and the base section seals the bottom of the hollow slot, and each fin is attached onto an inner wall of the respective hollow slot.

10. A water-cooling heat dissipating apparatus, comprising:

a heat dissipating structure, further comprising;

a vapor chamber, having a hollow slot penetrating through the vapor chamber, and further having a cavity;

a plurality of heat pipes, vertically installed to the vapor chamber, and communicated with the cavity; and

a heat dissipating member, including a substrate and a plurality of fins integrally extended from the substrate, and sealing the hollow slot by the substrate; and

a cover, covered onto the vapor chamber, and a liquid cavity being formed between the cover and the vapor chamber, and each heat pipe and each fin being formed in the liquid cavity, and the cover having a water inlet and a water outlet, both being communicated with the liquid cavity.

11. The water-cooling heat dissipating apparatus according to claim 10, wherein the substrate has a bottom side, and the vapor chamber has a heated surface, and the bottom side of the substrate and the heated surface of the vapor chamber form a common surface structure.

12. The water-cooling heat dissipating apparatus according to claim 11, wherein the heat dissipating structure further comprises a plurality of heat dissipating fins, and each heat dissipating fin has a plurality of through holes configured to be corresponsive to one another, and a circular wall extended from the periphery of each through hole, and each heat dissipating fin is coupled to each heat pipe through each through hole and stacked and coupled to one another through each respective circular wall, so as to form a liquid channel between any two adjacent heat dissipating fins.

13. The water-cooling heat dissipating apparatus according to claim 11, wherein the hollow slot is formed at a middle area of the vapor chamber, and the hollow slot has an upper receiving section disposed at the top of the vapor chamber, and the substrate includes a base section, vertical plate section bent and extended upwardly and separately from both sides of the base section, and a bridging section bent and extended from the vertical plate section in a horizontal direction, and the bottom side is formed outside the base section, and the base section seals the bottom of the hollow slot, and each bridging section is attached to each respective upper receiving section.

14. The water-cooling heat dissipating apparatus according to claim 13, wherein each vertical plate section is attached onto an inner wall of the respective hollow slot.

15. The water-cooling heat dissipating apparatus according to claim 13, wherein each fin is formed with an interval apart from the base section and each bridging section by extruding or chipping.

16. The water-cooling heat dissipating apparatus according to claim 11, wherein the hollow slot is formed at a middle area of the vapor chamber, and the vapor chamber installed at the external periphery of the hollow slot has a lower receiving section disposed at the bottom of the vapor chamber, and the substrate includes a base section and a bridging section extended from both sides of the base section in a horizontal direction, and the bottom side is formed outside the base section, and the base section seals the bottom of the hollow slot, and each bridging section is attached to each respective lower receiving section.

17. The water-cooling heat dissipating apparatus according to claim 11, wherein the substrate includes a base section, and the bottom side is formed outside the base section, and the base section seals the bottom of the hollow slot, and each fin is attached onto an inner wall of the respective hollow slot.

18. The water-cooling heat dissipating apparatus according to claim 11, wherein the vapor chamber has a circular insert slot formed at the top of the vapor chamber, and the bottom edge of the cover is embedded into the insert slot for sealing.

19. The water-cooling heat dissipating apparatus according to claim 11, further comprising a water inlet pipe and at least a water outlet pipe, wherein the water inlet pipe is coupled to the water inlet correspondingly, and the water outlet pipe is coupled to the water outlet correspondingly.

20. The water-cooling heat dissipating apparatus according to claim 19, further comprising a partition plate clamped between each heat pipe and the cover, and a liquid channel formed at a position of the partition plate corresponsive to the water inlet pipe.