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ETCHING SUBSTRATES USING ALE AND SELECTIVE DEPOSITION

  • US 20170316935A1
  • Filed: 04/21/2017
  • Published: 11/02/2017
  • Est. Priority Date: 04/29/2016
  • Status: Active Grant
First Claim
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1. A method of processing substrates, the method comprising:

  • (a) exposing a substrate comprising a first carbon-containing material to an oxidant and igniting a first plasma with a first bias power to modify a surface of the first carbon-containing material; and

    (b) exposing the modified layer to a second plasma at a second bias power and for a duration sufficient to remove the modified surface without sputtering.

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